High-resolution X-ray microscopy for correlative tomography, fast screening and in situ mechanical testing of structural and functional materials

高分辨率 X 射线显微镜，用于结构和功能材料的相关断层扫描、快速筛选和原位机械测试

• 批准号: 316992193
• 负责人: Professor Dr. Erdmann Spiecker
• 金额: --
• 依托单位: Erlangen Center for Interface Research and Catalysis
• 依托单位国家: 德国
• 项目类别: Major Instrumentation Initiatives
• 财政年份: 2016
• 资助国家: 德国
• 起止时间: 2015-12-31 至 2020-12-31
• 项目状态: 已结题
• 来源: https://gepris.dfg.de/gepris/projekt/316992193?language=en
• 关键词: resolution; ray; microscopy; correlative; tomography

The ultimate goal of materials engineering is the design of new materials with tailored properties. This requires information on the structure and mechanisms at all length scales and their complex interplay. On the experimental side this generates a strong need for high throughput and site-specific microscopic studies and a workflow which correlates complementary characterization methods at different length scales. The Center for Nanoanalysis and Electron Microscopy (CENEM) of the FAU Erlangen-Nürnberg provides cutting edge instrumentation for 3D characterization at small and medium length scales, including atom probe tomography, (S)TEM tomography and FIB tomography. At large length scales X-ray tomography methods are well established for materials characterization and failure analysis. Due to continuous improvements in X-ray technology resolutions down to sub-micron scale can now be achieved with modern micro- and Nano-CT equipment. However, so far only X-ray optics adopted from synchrotron sources achieve, on a regular basis, resolutions down to 50 nm in lab based microscope setups. This amazing resolution allows directly bridging the gap in sample volume and feature size between two non-destructive tomography techniques, X-ray and electron tomography. Directly linking electron tomography and X-ray tomography also connects fundamental, physics-based materials research with engineering applications. The scale-bridging 3D analysis enabled by correlative tomography furthermore provides important input for multiscale modeling approaches and integrated computational materials engineering. In this proposal we aim to complement the excellent instrumentation at CENEM with cutting-edge X-ray microscopy/nano-CT equipment and to establish workflows and data structures for correlative 3D characterization and modeling across length scales. In particular, we want to achieve the following: develop correlative 3D microscopy with complementary tomography techniques, establish scale-bridging materials characterization using site-specific preparation, perform non-destructive 3D in situ studies, including micromechanical tests, establish methods for direct use of 3D data for modelling and simulation of materials, and develop new fast screening approaches for combinatorial thin film research. The research efforts in this field will be sustained by a new professorship on Tomography of Materials and Processes, which will be jointly appointed by the FAU and the Development Center for X-Ray Technology (EZRT) of the Fraunhofer IIS. This project directly contributes to engineering of structural and functional materials in FAUs main research area New Materials and Processes, which comprises, among others, several Collaborative Research Centers (SFB/TR103, SFB814, SFB 953), the Research Training Group GRK1896 In Situ Microscopy with Electrons, X-Rays and Ecanning Probes, and the Cluster of Excellence Engineering of Advanced Materials.

材料工程的最终目标是设计出具有定制性能的新材料。这需要关于所有长度尺度的结构和机制及其复杂的相互作用的信息。在实验方面，这产生了对高通量和特定地点的微观研究的强烈需求，以及在不同长度尺度上将互补表征方法相关联的工作流程。FAU erlangen - n<s:1> rnberg的纳米分析和电子显微镜中心（CENEM）提供了用于中小尺度3D表征的尖端仪器，包括原子探针断层扫描，(S)TEM断层扫描和FIB断层扫描。在大长度尺度上，x射线断层扫描方法已经很好地建立了材料表征和失效分析。由于x射线技术的不断改进，现在可以用现代微型和纳米ct设备实现亚微米级的分辨率。然而，到目前为止，只有采用同步加速器源的x射线光学系统才能在实验室显微镜设置中实现常规的分辨率降至50纳米。这种惊人的分辨率可以直接弥合两种非破坏性断层扫描技术（x射线和电子断层扫描）在样本量和特征尺寸方面的差距。直接连接电子断层扫描和x射线断层扫描也连接了基础的，基于物理的材料研究与工程应用。相关层析成像实现的尺度桥接三维分析进一步为多尺度建模方法和综合计算材料工程提供了重要的输入。在本提案中，我们的目标是用尖端的x射线显微镜/纳米ct设备补充CENEM的优秀仪器，并建立跨长度尺度相关3D表征和建模的工作流程和数据结构。特别是，我们希望实现以下目标：利用互补断层扫描技术开发相关的3D显微镜，利用特定位点制备建立尺度桥接材料表征，进行非破坏性3D原位研究，包括微力学测试，建立直接使用3D数据进行材料建模和模拟的方法，并开发用于组合薄膜研究的新的快速筛选方法。该领域的研究工作将由FAU和Fraunhofer IIS的x射线技术发展中心（EZRT）联合任命的材料和工艺层析成像新教授来维持。该项目直接促进了学校主要研究领域“新材料与工艺”的结构与功能材料工程，包括SFB/TR103、SFB814、sfb953等多个合作研究中心，GRK1896电子、x射线和扫描探针原位显微镜研究培训小组，以及先进材料卓越工程集群。