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ポリマー繊維整然配列によってヒドロゲル熱伝導率の研究について

聚合物纤维有序排列水凝胶导热性能研究

基本信息

批准号：
20J22608
负责人：
GUO RULEI
金额：
$ 1.98万
依托单位：
The University of Tokyo
依托单位国家：
日本
项目类别：
Grant-in-Aid for JSPS Fellows
财政年份：
2020
资助国家：
日本
起止时间：
2020-04-24 至 2023-03-31
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-20J22608/
关键词：
TDTR Thermal conductivity TR-MOKE Wafer bonding TBC Graphene FDTR Mapping

项目摘要

1.The building of the time-domain thermoreflectance (TDTR) thermal property measurement system. Thermal property measurement is essential for understanding the transport and interaction processes of heat carriers and developing novel materials with desired thermal properties. Among the numerous measurement methods, TDTR offers unique advantages, including easy sample preparation, non-contact measurement, wide applicability, specific suitability for ultrathin films, thermal boundary conductance (TBC) measurement, and probing the ultrafast transport process. A TDTR measurement system with controll and data process programm has been developed with some new features, such as multiple objective lenses, wide range of modulation frequency, mapping sample stage, TDTR and TR-MOKE dual detectors.2.The TBC measurement of wafer bonding. In recent years, thermal management has become increasingly important for large-scale integrated circuits with the rising density of FETs integrated both horizontally and vertically in a limited space (3D ICs). Wafer bonding technology, which connects the device layer to a substrate with high thermal conductivity, holds promise for solving this issue. In that case, the thermal boundary conductance (TBC) of the interface between the two bonded wafers plays a vital role in thermal management performance. In this study, we developed a mapping system to obtain not only the value of TBC but also the spatial distribution of TBC of the Si-SiC sample, providing more detailed and stochastic knowledge about thermal transport at the interface.

1.时域热反射（TDTR）热性能测试系统的建立。热性能测量对于理解热载体的传输和相互作用过程以及开发具有所需热性能的新型材料至关重要。在众多的测量方法中，TDTR具有独特的优势，包括简单的样品制备，非接触式测量，广泛的适用性，特别适用于薄膜，热边界电导（TBC）测量和探测超快传输过程。研制了一套带有控制和数据处理程序的TDTR测量系统，该系统具有多物镜、宽调制频率范围、映射样品台、TDTR和TR-MOKE双探测器等特点。2.晶圆键合的TBC测量。近年来，随着在有限空间中水平和垂直集成的FET（3D IC）密度的增加，热管理对于大规模集成电路变得越来越重要。将器件层连接到具有高导热性的衬底的晶片键合技术有望解决这个问题。在这种情况下，两个键合晶片之间的界面的热边界传导（TBC）在热管理性能中起着至关重要的作用。在这项研究中，我们开发了一个映射系统，以获得不仅TBC的值，但也TBC的Si-SiC样品的空间分布，提供更详细的和随机的知识，在界面处的热传输。

项目成果

期刊论文数量（3）

专著数量（0）

科研奖励数量（0）

会议论文数量（0）

专利数量（0）

Scalable monolayer-functionalized nanointerface for thermal conductivity enhancement in copper/diamond composite

DOI：
10.1016/j.carbon.2021.01.018
发表时间：
2021-01
期刊：
Carbon
影响因子：
10.9
作者：
Bin Xu;S. Hung;Shiqian Hu;Cheng Shao;Rulei Guo;Junho Choi;T. Kodama;Fu-Rong Chen;J. Shiomi
通讯作者：
Bin Xu;S. Hung;Shiqian Hu;Cheng Shao;Rulei Guo;Junho Choi;T. Kodama;Fu-Rong Chen;J. Shiomi

SiC-Si接合界面での熱伝導のマッピング測定

SiC-Si结界面热传导映射测量