ポリマー繊維整然配列によってヒドロゲル熱伝導率の研究について

1.热反射系数(TDTR)热物性测试系统的建立。热物性测量对于了解热载体的传输和相互作用过程以及开发具有所需热物性的新型材料至关重要。在众多的测量方法中，TDTR具有样品制备简单、非接触测量、适用范围广、特别适用于超薄膜、热边界电导(TBC)测量以及探测超快输运过程等独特的优点。开发了一套具有控制和数据处理程序的TDTR测量系统，该系统具有多物镜、宽调制频率范围、映射采样平台、TDTR和TR-MOKE双探测器等新特点。2.晶圆键合的TBC测量。近年来，随着在有限空间(3DIC)水平和垂直集成的场效应管密度的不断提高，热管理对大规模集成电路变得越来越重要。晶片键合技术将器件层连接到具有高导热系数的衬底上，有望解决这一问题。在这种情况下，两个键合晶片之间界面的热边界电导(TBC)对热管理性能起着至关重要的作用。在这项研究中，我们开发了一个测绘系统，不仅可以获得TBC的值，还可以获得Si-SiC样品的TBC的空间分布，从而提供关于界面处热输运的更详细和随机的知识。

1.The building of the time-domain thermoreflectance (TDTR) thermal property measurement system. Thermal property measurement is essential for understanding the transport and interaction processes of heat carriers and developing novel materials with desired thermal properties. Among the numerous measurement methods, TDTR offers unique advantages, including easy sample preparation, non-contact measurement, wide applicability, specific suitability for ultrathin films, thermal boundary conductance (TBC) measurement, and probing the ultrafast transport process. A TDTR measurement system with controll and data process programm has been developed with some new features, such as multiple objective lenses, wide range of modulation frequency, mapping sample stage, TDTR and TR-MOKE dual detectors.2.The TBC measurement of wafer bonding. In recent years, thermal management has become increasingly important for large-scale integrated circuits with the rising density of FETs integrated both horizontally and vertically in a limited space (3D ICs). Wafer bonding technology, which connects the device layer to a substrate with high thermal conductivity, holds promise for solving this issue. In that case, the thermal boundary conductance (TBC) of the interface between the two bonded wafers plays a vital role in thermal management performance. In this study, we developed a mapping system to obtain not only the value of TBC but also the spatial distribution of TBC of the Si-SiC sample, providing more detailed and stochastic knowledge about thermal transport at the interface.