Development of a Fast Signal/Power Integrity Analysis Simulator for 3-Dimensional Integrated Circuits with Processing in Memory (PIM)

在这个项目下，PI能够进行一项新颖的研究，并在各种期刊和会议上发表文章（全部经过审查）。利用这笔预算，PI为具有新架构的高级封装（PIM）开发了一种新颖的统计/分析模拟器。所提出的模拟器/分析仪允许精确的SI/PI/EMI/EMC/HWS分析。利用仿真器，设计了支持PIM-HBM的噪声抑制结构和高速通道。同时，封装采用低损耗基板。在这种情况下，必须重新进行设计和分析。在这种情况下，所提出的模拟器提供了一个很有前途的解决方案，因为它可以实现超快速的SI/PI分析。研究结果在国际会议上作为特邀论文发表。这一结果也在IEEE先进封装学会中得到了强调。在IC设计教育中心（韩国IDEC）的“封装设计与分析”讲座中也介绍了这种方法。同时，将设计/仿真方法扩展到其他电气系统/封装/互连分析。该成果在硅谷举办的顶级行业会议DesignCon上进行了展示，并获得了最佳论文奖。

Under this project, the PI was able to conduct a novel research and publish various journals and conferences (all reviewed).Using this budget, the PI developed a novel statistical/analytical simulator for an advanced packages with a new architecture (PIM). The proposed simulator/analyzer allows an accurate SI/PI/EMI/EMC/HWS analysis.Using the simulator, noise suppression structures and high-speed channels are designed in the interposer supporting the PIM-HBM. Also, low-loss substrate is adopted in the package. Under this condition, the design and analysis must be conducted once again. The proposed simulator provides a promising solution under this case since it enables an ultra-fast SI/PI analysis. The result is presented at the international conference as an invited paper. This result is also highlighted in the IEEE advanced packaging society. This new method is also delivered at IC design education center (IDEC Korea)'s package design and analysis lecture as well. Also, the design/simulation method is expanded to other electrical system/package/interconnection analysis. The result is presented at DesignCon which is a top industry-oriented conference held in Silicon valley and won the best paper award.