Development of a Fast Signal/Power Integrity Analysis Simulator for 3-Dimensional Integrated Circuits with Processing in Memory (PIM)

开发用于具有内存处理 (PIM) 功能的 3 维集成电路的快速信号/电源完整性分析模拟器

• 批准号: 22K14241
• 负责人: Kim YoungWoo
• 金额: $ 3万
• 依托单位: Nara Institute of Science and Technology
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Early-Career Scientists
• 财政年份: 2022
• 资助国家: 日本
• 起止时间: 2022-04-01 至 2023-03-31
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-22K14241/
• 关键词: signal/power integrity; Packaging; EMI/EMI; Hardware Security; simulator development; 3-D IC; PIM

Under this project, the PI was able to conduct a novel research and publish various journals and conferences (all reviewed).Using this budget, the PI developed a novel statistical/analytical simulator for an advanced packages with a new architecture (PIM). The proposed simulator/analyzer allows an accurate SI/PI/EMI/EMC/HWS analysis.Using the simulator, noise suppression structures and high-speed channels are designed in the interposer supporting the PIM-HBM. Also, low-loss substrate is adopted in the package. Under this condition, the design and analysis must be conducted once again. The proposed simulator provides a promising solution under this case since it enables an ultra-fast SI/PI analysis. The result is presented at the international conference as an invited paper. This result is also highlighted in the IEEE advanced packaging society. This new method is also delivered at IC design education center (IDEC Korea)'s package design and analysis lecture as well. Also, the design/simulation method is expanded to other electrical system/package/interconnection analysis. The result is presented at DesignCon which is a top industry-oriented conference held in Silicon valley and won the best paper award.

在这个项目下，PI能够进行一项新的研究，并发表各种期刊和会议（所有审查）。使用此预算，PI开发了一个新的统计/分析模拟器，用于具有新架构的高级软件包（PIM）。该模拟器/分析器可以进行精确的SI/PI/EMI/EMC/HWS分析。使用该模拟器，在支持PIM-HBM的插入器中设计了噪声抑制结构和高速通道。封装采用低损耗衬底。在这种情况下，必须重新进行设计和分析。在这种情况下，所提出的模拟器提供了一个有前途的解决方案，因为它可以实现超快速的SI/PI分析。研究结果作为特邀论文在国际会议上发表。这一结果也在IEEE高级封装协会中得到了强调。这种新方法也在IC设计教育中心（IDEC韩国）的封装设计和分析讲座上发表。此外，设计/仿真方法扩展到其他电气系统/封装/互连分析。结果在硅谷举行的顶级行业会议DesignCon上发表，并获得最佳论文奖。

项目成果

Micromachines

微型机械

• 发表时间: 2017
• 期刊: Micromachines
• 影响因子: 3.4
• 作者: Lisheng Liu;Tao Bai;Qingjia Chi;Zhen Wang;Shuang Xu
• 通讯作者: Shuang Xu

Interposer Channel Design based on Statistical Signal/Power Integrity Co-analysis

基于统计信号/电源完整性协同分析的内插器通道设计

• 发表时间: 2022
• 作者: Simultaneous Security and EMC Evaluations Based on Measuring Electromagnetic Field Distributions on PCBs;Design of Power/Ground Noise Suppression Structures Based on a Dispersion Analysis for Packages and Interposers with Low-Loss Substrates;Youngwoo Kim;Youngwoo Kim
• 通讯作者: Youngwoo Kim

Youngwoo Kim, Daisuke Fujimoto, and Yuichi Hayashi

金英雨、藤本大辅、林佑一

• 发表时间: 2022
• 期刊: IEEE Electromagnetic Compatibility Magazine
• 作者: Simultaneous Security and EMC Evaluations Based on Measuring Electromagnetic Field Distributions on PCBs

How to Design Secured Power Delivery Network of Cryptographic Devices: Challenges, Evaluation Methods, and Solutions

如何设计加密设备的安全供电网络：挑战、评估方法和解决方案

• 发表时间: 2023
• 作者: Ryosuke Ota;Nobukazu Hoshi;Liangliang Wei; Taketsune Nakamura;Youngwoo Kim
• 通讯作者: Youngwoo Kim

Analysis of Filtering Window Impacts on Estimation Accuracy of Information Leakage from Exposed Power Delivery Network of Cryptographic Devices

滤波窗口对密码设备暴露供电网络信息泄漏估计精度的影响分析

• 发表时间: 2022
• 作者: Youngwoo Kim;Shinpei Wada;Daisuke Fujimoto;and Yuichi Hayashi
• 通讯作者: and Yuichi Hayashi