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Low Temperature Heat Process of Reversible Shape Memory Alloy Thin Film on Si Water

硅水上可逆形状记忆合金薄膜的低温热处理

基本信息

批准号：
06452230
负责人：
KURIBAYASHI Katsutoshi
金额：
$ 4.86万
依托单位：
Yamaguchi University
依托单位国家：
日本
项目类别：
Grant-in-Aid for General Scientific Research (B)
财政年份：
1994
资助国家：
日本
起止时间：
1994 至 1995
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-06452230/
关键词：
Micro actuator TiNi alloy Si substrate Heat process Jourle's heat Shape memory alloy

项目摘要

Reversible shape Memory alloy (RSMA) (TiNi alloy) Thin Film actuators have many advantages for micromachines, for example, the films have three functions ; 1) a frame of the arm, 2) a joint of the arm and 3) an actuator of the arm and the films could actuate the arm without frictions with low driving electrical voltage. To develop the micron sized actuator system with RSMA on silicon substrates, the spattering deposition technique for the thin films of TiNi alloy and the wet etching process were established. However, the same heat treatment as the method for bulk TiNi alloy was reported to be unsuccessful to crystallize the spattered amorphous thin films because the thin films were stripped off from the silicon substrates. In this study, to solve the problem, a heat treatment method by Joule's heat of electrical current direct through the TiNi alloy thin films on the silicon wafers was proposed. Reversible shape memory effect of TiNi thin films treated by direct Joule's heat and the conventional furnace was evaluated.The results indicate that the heat treatment system using direct Joule's heat is effective for the crystallization of the sputtering deposited TiNi thin films.This system has potential to realize not only the crystallization of TiNi thin films without stripping from silicon wafer but also shape memorizing heat treatment. TiNi film heat crystallyzed by the direct Joule's heat show better RSME than that by the conventional furnace.

可逆形状记忆合金(RSMA)(TiNi合金)薄膜驱动器具有三种功能：1)臂的框架，2)臂的关节，3)臂和薄膜的驱动器可以在低的驱动电压下无摩擦地驱动臂。为了开发硅衬底上具有RSMA的微米级驱动器系统，建立了TiNi合金薄膜的溅射沉积技术和湿法腐蚀工艺。然而，据报道，与块体TiNi合金相同的热处理方法不能成功晶化溅射的非晶薄膜，因为薄膜从硅衬底上剥离。为了解决这一问题，本研究提出了一种直接通过硅片上TiNi合金薄膜的焦耳热进行热处理的方法。评价了直接焦耳加热和常规加热处理的TiNi薄膜的可逆形状记忆效应。结果表明，直接焦耳加热热处理系统对溅射沉积的TiNi薄膜的晶化是有效的，该系统不仅有可能实现TiNi薄膜的晶化而不剥离硅片，而且还有可能实现形状记忆热处理。用直接焦耳加热结晶的TiNi薄膜表现出比常规加热更好的RSME。