"Evaluation of Three-Dimensional Residual Stress in Bonding Layr with Polarized Laser"

“用偏振激光评估键合层的三维残余应力”

• 批准号: 05805010
• 负责人: NIITSU Yasushi
• 金额: $ 1.28万
• 依托单位: TOKYO DENKI UNIVERSITY
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for General Scientific Research (C)
• 财政年份: 1993
• 资助国家: 日本
• 起止时间: 1993 至 1994
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-05805010/
• 关键词: Experimental Stress Analysis; Photoelasticity; Three dimensional Stress Analysis; Adhesive Bonding; Residual Stress; 応力分布計測; 接着; 光弾性実験; 三次元応力; 光弾性変調器

Optical birefringence was measured by a high frequency modulation method using a photoelastic modulator and a polarized laser. This measurement has the high sensitivity required to measure small birefringence produced by stress. The following results were obtained with developed measurement.(1) The optical birefringence distributions were measured for the bonded rectangular glass plates with epoxy resin. With those results, the residual stress distribution in adhesive layr caused by the bonding process was evaluated. Consequently, the maximum tensile stress applied at the side and corner, and the biaxial tension applied at the inside.(2) The new synthesized photoelastic method was developed for calculation of stress and its direction with laser potoelasticity measurement. The distributions of optical birefringence corresponding to stress were measured for the tensile glass plates with a hole and notches. Measured stress distributions agreed well with the FEM analysis, and it was confirmed that the new method would be useful to detect the microscopical stress fields.(3) I tried to evaluate the three dimensional stress distribution from two dimensional its projection. But it was difficult analytically. The combination of FEM and experimental results has possibility of three dimensional stress evaluation.

通过使用光弹性调制器和偏振激光的高频调制方法测量光学双折射。该测量具有测量由应力产生的小双折射所需的高灵敏度。通过改进的测量获得了以下结果。(1)测量了环氧树脂粘接矩形玻璃板的光学双折射分布。利用这些结果，对粘接过程中引起的胶层残余应力分布进行了评估。因此，最大拉应力施加在侧面和拐角处，双向拉伸施加在内侧。(2)提出了一种新的综合光弹法，用于激光光弹测量中应力及其方向的计算。测量了具有孔和切口的拉伸玻璃板的光学双折射随应力的分布。实测应力分布与有限元分析结果吻合较好，证实了该方法在检测微观应力场方面的实用性。(3)我试着从二维的投影来估计三维的应力分布。但分析起来很困难。将有限元分析与试验结果相结合，为三维应力评估提供了可能。

项目成果

Y.NIITSU,K.ICHINOSE and K.IKEGAMI: "Stress Measurement of Transparent Materials by Polarized Laser" Trans.of JSME,Series-A. Vol.59, No.559. 600-605 (1993)

Y.NIITSU、K.ICHINOSE 和 K.IKEGAMI：“偏振激光透明材料的应力测量”Trans.of JSME，Series-A。

Y.NIITSU and K.GOMI: "Influence of Crystal Orientation on Photoelastic Properties of Silicon Single Crystal" Proc.of Advanced in Electronic Packaging. Vol.10-2. 1239-1245 (1995)

Y.NIITSU 和 K.GOMI：“晶体取向对硅单晶光弹性特性的影响”Proc.of Advanced in Electronic Packaging。

Yasushi NIITSU: "Accuracy Evaluation of Stress Measurement in Silicon Crystal by Microscopic Raman Spectroscopy" Proc.of Int.Electronics Packaging Conference. 1. 255-259 (1993)

Yasushi NIITSU：“通过显微拉曼光谱对硅晶体中的应力测量进行准确度评估”国际电子封装会议论文集。

K.ICHINOSE and Y.NIITSU: ""Experimental stress analysis by Shear Difference Method using Results of Synthesized Method"" Proc.of JSME Annual Meeting. No.95-1, Vol.2. 626-627 (1995)

K.ICHINOSE 和 Y.NIITSU：““使用合成方法结果通过剪切差法进行实验应力分析””JSME 年会论文集。

Yasusi NIITSU: "Stress Measurement of Transparent Materials by Polarized Laser" JSME Int. J. Series-A. Vol.38 No.1. 68-72 (1995)

Yasusi NIITSU：“偏振激光透明材料的应力测量”JSME Int。