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Vibratory Creep Feed Grinding

Vibratory Creep Feed Grinding
振动蠕动进给磨削
批准号:
06650158
负责人:
WADA Tadahiro
金额:
$0.38万
依托单位国家:
日本
项目类别:
Grant-in-Aid for General Scientific Research (C)
财政年份:
1994
资助国家:
日本
项目状态:
已结题
起止时间:
1994 至 1995

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中文摘要
翻译
缓进给磨削时,最大切削力变小,有效刃上的切削力变小。因此,砂轮工作面经常发生加载和擦伤。由于接触弧长,磨削点温度随切削力的增加而升高。因此,经常会在工件上造成热损伤,如烧伤痕迹。为了防止烧伤痕迹的形成,提出了采用振动缓进给磨削的方法。工件沿工作台进给方向受迫振动,即频率为30 Hz,幅值为0.32~1.5 mm。为了阐明振动缓进给磨削的有效性,对磨削性能进行了实验研究。主要研究结果如下:(1)振动缓进给磨削的磨削功率比常规缓进给磨削小。(2)振动缓进给粉磨…在磨削深度为3 mm、台面速度为0.179 mm/S的条件下,SKH_4和SUS_(304)向下磨削对防止烧痕效果较好,但振动缓进给磨削时砂轮磨损较常规缓进给磨削大。(3)在SKH4的振动缓进给磨削中,在振幅为1.0 mm或1.5 mm的情况下,可防止烧伤痕迹的产生。此外,采用WA型磨料砂轮进行SHK4的振动缓进给磨削时,砂轮径向磨损量比常规缓进给磨削小。(4)向下切削缓进给磨削时,砂轮-工件接触区的磨削液比常规缓进给磨削多。然而,在上切向振动缓进给磨削中,磨削液的供应量并没有增加。(5)在相同的金属去除速率下,振动缓进给磨削时,砂轮的径向磨损量和垂直磨削力均随砂轮切削量的增加而增大。较少
英文摘要
In creep feed grinding, the maximum grain depth of cut becomes smaller, and so the cutting force on an effective edge becomes smaller. Then the loading and grazing often occurs on the working face of the grinding wheel. Because of a long arc of contact, the temperature at the grinding point rises with the increase of cutting force. Consequently thermal damage such as a burn mark is often made on a workpiece. In order to prevent the formation of the burn mark, vibratory creep feed grinding is proposed in this study. The workpiece was forced to vibrate in the table feed direction, that is to say, the frequency fis 30Hz and amplitude 2A is from 0.32 to 1.5mm. In order to clarify the effectiveness of the vibratory creep feed grinding, the grinding performance are experimentally investigated. The main results obtained are as follows : (1) The grinding power in the vibratory creep feed grinding becomes smaller than that in the conventional creep feed grinding. (2) Vibratory creep feed grindi … More ng is effective for the prevention of the burn mark in case of down-cut grinding of SKH4 and SUS304 under the wheel depth of cut 3mm and the table speed 0.179mm/s. However, the wheel wear in vibratory creep feed grinding becomes larger than that in the conventional creep feed grinding. (3) In the vibratory creep feed grinding of SKH4, the burn mark was prevented under the amplitude 2A of 1.0mm or 1.5mm. Moreover the radial wheel wear in the vibratory creep feed grinding of SHK4 with WA abrasive grinding wheel becomes smaller than that in the conventional creep feed grinding, (4) In down-cut vibratory creep feed grinding, more grinding fluid is supplied to the wheel-workpiece contact area than in the conventional creep feed grinding. However, in up-cut vibratory creep feed grinding, the amount of grinding fluid supplied does not increase. (5) In vibratory creep feed grinding, both radial wheel wear and vertical grinding force increase with the increase of the wheel depth of cut under the same metal removal rate. Less
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会议论文
J. Kyokane, M. Yoshimizu etal: "Effects of Ion Bean Imadiation on Electrical Properties of LB Films" International Symposium on Electrical Insulating Materials. ISEIM‘95. 89-92 (1995)
J. Kyokane、M. Yoshimizu 等人:“离子豆辐射对 LB 薄膜电性能的影响”国际电绝缘材料研讨会。ISEIM‘95 (1995)。
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T.Wada: "Vibratory Creep Feed Grinding" Research Reports of Nara National Collage of Technology. No.31. 5-9 (1996)
T.Wada:奈良国立技术大学的“振动蠕变进给研磨”研究报告。
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J. Kyokane, I. Taniguchi etal: "Conducting Organic Thin Films by Ion-Assisted Evaporation and Their Application to Electronic Devices and Components" Synthetic Metals. 71. 2217-2218 (1995)
J. Kyokane、I. Taniguchi 等人:“通过离子辅助蒸发传导有机薄膜及其在电子设备和组件中的应用”合成金属。
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