Xenonbasiertes Focused Ion Beam Rasterelektronen-Mikroskop (FIB-REM) mit integrierter RAMAN-Spektroskopie

在工厂自动化和生产系统(FAPS)主席，将通过DFG的资助，以大约130万欧元的价格购买具有集成拉曼光谱的氙基聚焦离子束(FIB)扫描电子显微镜(FIB-REM)。弗里德里希-亚历山大-纽伦堡大学厄兰根-纽伦堡在材料科学和工艺研究领域享誉全球。特别是，FAPS为生产机电功能而研究的新技术，如空间电路载体的激光结构金属化(MID)、使用选择性激光熔化(SLM)或冷激活等离子体金属化(CAPM)的电力电子组件的附加生产以及电子和光学功能(天线、光伏、OLED、传感器等)的印刷。在3D表面上使用墨水、纳米或压电喷射，在世界各地都是独一无二的。基于介电弹性致动器的人造肌肉、器官模型或用于人眼孔径控制的机电虹膜的生产也是史无前例的。在小型化电子组件的扩散焊接和银烧结组装和连接技术、电机结构中激光或超声波焊接的电接触以及连接器可靠性分析等领域的国际领先研究活动，也需要对连接器的几何细节和材料结构以及材料、工艺、环境条件和工厂规格之间的相互关系有深刻的了解。为了更准确地了解所调查的过程并开拓新的潜力，获得在原子水平上分析物质条件和行为的先进技术和仪器是一个基本的先决条件。扫描电子显微镜(SEM)是最先进的技术。扫描电子显微镜与氙基聚焦离子束(FIB)和拉曼光谱的结合开辟了全新的可能性，但FAU尚未提供。

At the Chair of Factory Automation and Production Systems (FAPS) a xenon-based Focused Ion Beam (FIB) - Scanning Electron Microscope (FIB-REM) with integrated RAMAN spectroscopy is to be acquired for about 1.3 million € through funding by the DFG. The Friedrich-Alexander-University Erlangen-Nuremberg enjoys an excellent worldwide reputation in the fields of Material Sciences and Process Research. In particular, the new techniques researched at FAPS for the production of mechatronic functions, such as the laser-structured metallization of spatial circuit carriers (MID), the additive production of power electronic assemblies using selective laser melting (SLM) or cold active plasma metallization (CAPM) and the printing of electronic and optical functions (antennas, PV, OLED, sensors, etc.) on 3D surfaces with ink-, nano- or piezo jetting, are unique worldwide. The generative production of artificial muscles, organ models or a mechatronic iris for aperture control in the human eye on the basis of dielectric elastomer actuators is also unprecedented. The internationally leading research activities in the fields of assembly and connection technology of miniaturized electronic modules by means of diffusion soldering and silver sintering, electrical contacting in electrical machine construction by means of laser or ultrasonic welding as well as the analysis of the reliability of connectors also require a profound understanding of the geometric details and material structure as well as the interrelationships between material, process, environmental conditions and plant specifications. In order to understand the investigated processes more precisely and to open up new potentials, access to advanced techniques and instruments for the analysis of material condition and behaviour on an atomic level is a basic prerequisite. Scanning electron microscopy (SEM) is state of the art. The combination of the SEM with a xenon-based Focused Ion Beam (FIB) and a RAMAN spectroscopy opens up completely new possibilities and is not yet available at the FAU.