Development of a Microwave Focusing Sensor and a High Resolution Imaging System for Nondestructive Evaluation of Materials

开发用于材料无损评估的微波聚焦传感器和高分辨率成像系统

• 批准号: 11555025
• 负责人: SAKA Masumi
• 金额: $ 8.38万
• 依托单位: Tohoku University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B).
• 财政年份: 1999
• 资助国家: 日本
• 起止时间: 1999 至 2000
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-11555025/
• 关键词: Nondestructive Evaluation; Microwave; Focusing Sensor; Imaging; Spatial Resolution; Delamination; IC Package; Materials

1.Clarification of the principles of microwave focusing and reflecting by using electromagnetic wave theory A focusing sensor was developed. The microwave reflection occurring at the interface of the materials, in a small area, was analyzed. The characteristic of the microwave response relative to the size and the shape of defects, and their electromagnetic properties was clarified.2.Evaluation of delaminations with a high spatial resolution The delaminations between the lead frame and the encapsulant resin in IC packages were evaluated. The variations of the amplitude and the phase of the reflection coefficient, for the samples with and without delaminations, were observed. The parameters used for evaluation of the delamination in a high spatial resolution were obtained.3.Development of the microwave imagine system The microwave sensor was used to scan the detected object in two perpendicular directions in a plane parallel to the object. A high speed imaging system was developed, wher … More e information of the defects was recorded corresponding to the measurement position.4.Improvement of the focusing sensor For increasing the spatial resolution, the shape and the set position of the focusing sensor were optimized. The spatial resolution was further increased while a larger standoff distance between the sensor and the detected object was remained.5.Microwave applications in evaluation of the thickness of films and coating materials and the state of the interface between the coating materials and their substrates A new method for evaluation of the conductive film, which has widely been used in the manufacture of liquid crystal and solar cell etc., was investigated. Moreover, the capability of microwave to detect a small crack in the silicon film, which is used to make solar cells, was also confirmed.6.Development of the compact imagine system Based on the developed imaging system, the compact imaging system was designed fundamentally, which is expected to be used for large machines and structures in the industrial environment. A new scanning sensor was suggested for realizing the small size, low cost and popular imaging system. Less

1.用电磁波理论阐明了微波聚焦和反射的原理。分析了在小范围内材料界面处发生的微波反射现象。阐明了微波响应特性与缺陷的大小和形状以及它们的电磁特性的关系。2.高空间分辨率的分层评估对IC封装中引线框架和封装树脂之间的分层进行了评估。观察了有无分层样品的反射系数的振幅和相位的变化。3.微波成像系统的研制利用微波传感器在平行于被测物体的平面内沿两个垂直方向对被测物体进行扫描。研制了一种高速成像系统， ...更多信息 4.聚焦传感器的改进为了提高空间分辨率，对聚焦传感器的形状和设置位置进行了优化。5.微波在薄膜、涂层材料厚度及涂层材料与基体界面状态评价中的应用一种新的评价导电薄膜的方法，该方法已广泛应用于液晶、太阳能电池等领域，被查此外，还证实了微波探测太阳能电池用硅薄膜中微小裂纹的能力。6.紧凑型成像系统的研制基于研制的成像系统，初步设计了紧凑型成像系统，该系统有望用于工业环境中的大型机械和结构。为了实现小型化、低成本、普及化的成像系统，提出了一种新型扫描传感器。少

项目成果

Y.Ju (M.Saka and H.Abe): "NDI of Delamination in IC Packages Using Millimeter-Wave"Proc.17th IEEE Instrumentation and Measurement Technology Conference. 3. 1597-1602 (2000)

Y.Ju（M.Saka 和 H.Abe）：“使用毫米波的 IC 封装分层的 NDI”Proc.17th IEEE 仪器和测量技术会议。

M.Saka (Y.Ju,D.Luo and H.Abe): "A Method for Nondestructive Evaluation of Crack Depth on Metal Surface by Microwaves"25th International Conference on Infrared and Millimeter Waves Conference Digest, IEEE. 423-424 (2000)

M.Saka（Y.Ju、D.Luo 和 H.Abe）：“微波无损评估金属表面裂纹深度的方法”第 25 届国际红外和毫米波会议文摘，IEEE。

M.Saka(Y.Ju): "Materials Evaluation by Using Microwave"Trans.JSME(A). Vol.65, No.639. 2193-2198 (1999)

M.Saka(Y.Ju)：《利用微波进行材料评价》Trans.JSME(A)。

Y.Ju(Y.Kaneko, M.Saka and H.Abe): "Nondestructive Evaluation of Dielectric Materials by Microwave Imaging"J.JSNDI. Vol.49, No.2. 121-126 (2000)

Y.Ju（Y.Kaneko、M.Saka 和 H.Abe）：“通过微波成像对介电材料进行无损评估”J.JSNDI。

巨陽(金子祐二,坂真澄,阿部博之): "マイクロ波イメージングによる誘電体材料部分の欠陥の非破壊評価"非破壊検査. 49・2. 121-126 (2000)

Kyoyo（Yuji Kaneko、Masumi Saka、Hiroyuki Abe）：“使用微波成像对介电材料部件中的缺陷进行无损评估”49・2（2000）。