Development of a Millimeter-Wave Imaging Compact System & Contaceless and Quantitative Evaluation of Delamination and Crack with High Spatial Resolution

毫米波成像紧凑系统的开发

• 批准号: 13555023
• 负责人: SAKA Masumi
• 金额: $ 8.32万
• 依托单位: Tohoku University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B)
• 财政年份: 2001
• 资助国家: 日本
• 起止时间: 2001 至 2002
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-13555023/
• 关键词: Millimeter Waves; Imaging; Compact System; Focusing Sensor; Nondestructive Evaluation; Resolution; Sensitivity; Liftoff Distance; 非破壊

1. Development of a compact imaging systemUsually, network analyzer is used as the equipment for microwave nondestructive testing. However, network analyzer has lager size and its price is high. Hence it becomes difficult to use it in the industrial environment. Therefore, a millimeter-wave compact equipment was developed to overcome these problems. Both the amplitude and the phase measurement can well be carried out by the compact equipment.2. Development of a millimeter-wave reflection focusing sensorA millimeter-wave focusing sensor utilizing two ellipsoidal reflectors woo developed for nondestructive evaluation of materials. By using the focusing sensor, liftoff distance between the sensor and sample woo effectively enlarged, while a higher spatial resolution was also obtained.3. Detection of defects and evaluation of electrical characteristics in electronic devices and thin films with high spatial resolutionThe delamination, which may occur between the chip pad and the encapsulate resin in IC packages, was inspected by millimeter-wave imaging technique. The full and part delamimations were successfully detected. Also a method for contactless measurement of the conductivity of thin conducting films, such us Indium Tin Oxide film, was developed. The measurement was successfully carried out by using the millimeter-wave compact equipment.4. Quantitative evaluation of closed small cracks on the metal surfaceA dual frequency technique was developed to evaluate the depth of small 2-D cracks of which situation regarding crack closure is unknown. On the other hand, a method to evaluate closure stress of cracks was developed. The effect of closure stress on the dual frequency technique was evaluated. In addition, to evaluate 3-D cracks, from the modified dual frequency equation, a new component named interference waveform was introduced, by which the shape and size of small 3-D cracks were successfully evaluated.

1.一种紧凑型成像系统的研制微波无损检测设备通常采用网络分析仪。然而，网络分析仪体积较大，价格昂贵。因此，很难在工业环境中使用。因此，毫米波紧凑型设备的开发，以克服这些问题。该装置结构紧凑，可以很好地进行幅值和相位的测量.毫米波反射聚焦传感器的研制利用两个椭球反射器的毫米波聚焦传感器是为材料的无损评价而研制的。采用聚焦传感器，有效地增大了传感器与样品之间的离地距离，同时获得了较高的空间分辨率.高空间分辨率电子器件和薄膜的缺陷检测与电学特性评价利用毫米波成像技术对IC封装中芯片焊盘与封装树脂之间可能出现的分层进行了检测。成功检测到全部和部分分层。本文还提出了一种非接触式测量导电薄膜（如氧化铟锡薄膜）电导率的方法。利用毫米波小型化装置成功地进行了测量.金属表面闭合小裂纹的定量评估双频技术被开发用于评估关于裂纹闭合情况未知的二维小裂纹的深度。另一方面，提出了一种计算裂纹闭合应力的方法。评价了闭合应力对双频技术的影响。此外，为了对三维裂纹进行评估，在修正的双频方程中引入了干涉波形分量，成功地对三维小裂纹的形状和尺寸进行了评估。

项目成果

Y.Ju(M.Saka, H.Abe): "Microwave Imaging of Delaminations in IC Packages"Review of Progress in Quantitative Nondestructive Evaluation. Vol. 21(掲載予定). (2002)

Y.Ju（M.Saka，H.Abe）：“IC 封装中分层的微波成像”定量无损评估进展回顾，第 21 卷（待出版）。

Y.Ju(M.Saka, T.Hiroshima): "Nondestructive Detection of Small Cracks in Polycrystalline Sillicon Substrates Using Millimeter Waves"Proc. 6th Far-East Conf. on Nondestructive Testing(FENDT '02). pp.535-539 (2002)

Y.Ju（M.Saka，T.Hiroshima）：“使用毫米波对多晶硅基板中的小裂纹进行无损检测”Proc。

広沢 容(巨 陽, 坂 真澄): "マイクロ波コンパクト装置による材料非破壊評価"日本非破壊検査協会平成13年度秋季大会講演概要集. 21-22 (2001)

Yo Hirosawa（Yo Kyo，Masumi Saka）：“使用紧凑型微波设备对材料进行无损评估”日本无损检测协会2001年秋季会议讲座摘要21-22（2001）。

坂 真澄(内村 泰博): "マイクロ波による三次元疲労き裂の定量評価"日本機械学会平成14年度材料力学部門講演会講演論文集. 505-506 (2002)

Masumi Saka（Yasuhiro Uchimura）：“使用微波对三维疲劳裂纹进行定量评估”日本机械工程学会材料力学分会论文集 2002 年 505-506（2002）。

M.Saka(T.Miyadu, Y.Uchimura, Y.Ju): "An Effect of Crack Closure Stress on the Microwave Dual Frequency Technique"Proc. 38th JSME Tohoku Branch Meeting. No.031-1. pp.224-225 (2003)

M.Saka（T.Miyadu，Y.Uchimura，Y.Ju）：“裂纹闭合应力对微波双频技术的影响”Proc。