Fundamental Investigation into the Mechanisms of Ultrasonic Assisted Single-Component and Multi-Component Low Temperature Sintering for the Assembly of Power Electronic Components

电力电子元件装配超声辅助单组分和多组分低温烧结机理的基础研究

• 批准号: 456662835
• 负责人: Dr.-Ing. Jens Twiefel
• 金额: --
• 依托单位: Institut für Mikroproduktionstechnik (IMPT)
• 依托单位国家: 德国
• 项目类别: Research Grants
• 资助国家: 德国
• 项目状态: 未结题
• 来源: https://gepris.dfg.de/gepris/projekt/456662835?language=en
• 关键词: Fundamental; Investigation; into; Mechanisms; Ultrasonic

Today's demands on power electronics have increased significantly, especially due to e mobility, so that the connection properties of proven processes such as soldering or bonding no longer meet future requirements. Especially the electrical and thermal conductivity as well as the increased process temperatures are challenges. As a result, silver compound sintering has become increasingly important in recent years. Here, a substrate and a chip are connected by a sintered intermediate layer of silver. Compared to traditional compounds, the properties of silver compound sintering are many times better. Why is this process not yet widely used? The reason are the high values of pressure and temperature required for the process. The process times are significantly longer than with other methods, so that currently only a batch process is economical; however, this leads to irregular joint qualities. This is where our research project comes in. We were able to show that in single chip assembly, the introduction of ultrasound into the bonding layer has a significantly positive effect on the formation of the bond, so that the process temperature, pressure and times were reduced. In addition, the process was extended by an alloying partner to form a new type of multi-component, ultrasonic-assisted process, which is introduced as Ultrasonic Transient Liquid Phase Sintering (UTLPS). Here, we were able to show first positive effects, too. The guiding questions for this research project are: Which mechanisms have a positive effect on the formation of compounds when using ultrasound? Is the diffusion process accelerated by ultrasound analogous to wire bonding? For this purpose, micro- and nanoscale sintering pastes will be developed first. Subsequently, the experimental investigation of the parameter influences on the joint quality will be carried out to enable a separation from the ultrasonic influence parameters. These are mainly the vibration amplitude, the power and the duration of the ultrasound. After the optimal ultrasonic direction (horizontal or vertical) has been determined, the time profile of the process is analyzed. Porosity and mechanical strength are measured to evaluate the joints and supplemented with other analysis methods. The investigations are performed on passive test chips and on active components (diode, IGBT, NTC). Here, the ultrasonic influence on the quality of the connection and the durability as well as possible damage to the components are examined. The research project is concluded with the model-based description of the mechanisms of ultrasonic assisted silver compound sintering. By answering the key questions, silver compound sintering will be significantly improved. This opens up this bonding technology for many more applications.

当今对电力电子产品的需求已大大增加，尤其是由于E移动性，因此焊接或粘结等经过验证的过程的连接属性不再满足未来的要求。尤其是电导率和导热率以及工艺温度升高是挑战。结果，近年来，银复合烧结变得越来越重要。在这里，底物和芯片由银的烧结中间层连接。与传统化合物相比，银复合烧结的特性要好得多。为什么此过程尚未广泛使用？原因是该过程所需的高压和温度值。该过程时间明显比其他方法更长，因此目前只有批处理过程是经济的。但是，这导致了不规则的联合品质。这是我们的研究项目的来源。我们能够证明，在单个芯片组装中，将超声引入键层对键的形成具有显着积极的影响，以便降低过程温度，压力和时间。此外，合金伙伴将该过程扩展了该过程，形成了一种新型的多组分超声辅助过程，该过程被引入为超声波瞬态液体相（UTLP）。在这里，我们也能够表现出第一个积极的影响。该研究项目的指导性问题是：使用超声检查时哪些机制对化合物的形成产生积极影响？扩散过程是否通过类似于电线键的超声加速？为此，将首先开发微级和纳米级烧结糊。随后，将对参数影响关节质量的实验研究，以使其与超声影响参数分离。这些主要是振动幅度，超声的功率和持续时间。确定最佳超声方向（水平或垂直）之后，分析了该过程的时间曲线。测量孔隙度和机械强度以评估关节并补充其他分析方法。研究对被动测试芯片和主动组件进行（Diode，IGBT，NTC）。在这里，检查了对连接质量以及耐用性的影响以及对组件的可能损坏的影响。该研究项目以基于模型的超声辅助银复合烧结机制的模型描述结束。通过回答关键问题，银色复合烧结将得到显着改善。这为更多应用程序打开了这种键合技术。