A Study on A Sensor Skin Using Wire-Free Tactile Sensing Elements Based on Optical Connection

基于光学连接的无线触觉传感元件传感器皮肤的研究

基本信息

  • 批准号:
    13450168
  • 负责人:
  • 金额:
    $ 10.82万
  • 依托单位:
  • 依托单位国家:
    日本
  • 项目类别:
    Grant-in-Aid for Scientific Research (B)
  • 财政年份:
    2001
  • 资助国家:
    日本
  • 起止时间:
    2001 至 2002
  • 项目状态:
    已结题

项目摘要

In this project we proposed a new structure of tactile sensing device. The tactile sensing chip operates with optical power, and sends optical codes of 6 stress components around the chip. Since the sensing device includes no metal wire, the integration process of tactile sensing elements and a tactile sensor body is simple that enables us to implant high density of tactile sensing elements without loss of elasticity and toughness of the sensing device. The results of the study are summarized as follows.1) We showed the chip design and the 6 stress sensing principle, and examined it experimentally. The tactile sensing chip consists of a VLSI chip and an elastic structure attached on it that deforms by the stress around it. The VLSI chip detects the light intensity that reaches on it through the elastic structure, and it detects the deformation of the elastic structure from the detected light intensity. Using its symmetry of the structure it detects 6 components of stress tensor by the 8 photo-detectors formed on the VLSI chip.2) The detected sensing date are sent with digital codes of optical signal. We fabricated VLSI chip with communication functions including automatic ID assignment to each sensing chip. The circuit based on CMOS 0.35 μm rule occupied 1 mm by 1.4 mm on the chip, and we confirmed the 10 MHz operation.3) Energy consumption with large number of tactile sensing elements with sufficient throughput for tactile sensing was evaluated. This research exposed wireless connection requires inevitable energy consumption that is not suitable for practical tactile sensor. This will motivate a new research area of communication among sensing chips.
在本计画中,我们提出一种新的触觉感测装置结构。触觉传感芯片以光功率工作,并在芯片周围发送6个应力分量的光代码。由于感测装置不包括金属线,触觉感测元件和触觉传感器主体的集成过程简单,使得我们能够植入高密度的触觉感测元件,而不会损失感测装置的弹性和韧性。主要研究成果如下:1)介绍了芯片设计和6种应力传感原理,并进行了实验验证。触觉传感芯片由VLSI芯片和附着在其上的弹性结构组成,弹性结构通过其周围的应力而变形。VLSI芯片检测通过弹性结构到达其上的光强度,并且其根据检测到的光强度来检测弹性结构的变形。利用其结构的对称性,通过在VLSI芯片上形成的8个光电探测器检测应力张量的6个分量。2)检测的传感数据用光信号的数字编码发送。我们制作了具有通信功能的VLSI芯片,包括自动为每个传感芯片分配ID。基于CMOS 0.35 μm规则的电路在芯片上占用1mm × 1.4mm,我们确认了10MHz的操作。3)评估了具有足够吞吐量的大量触觉传感元件的能耗。该研究暴露了无线连接需要不可避免的能量消耗,这不适合实际的触觉传感器。这将激发一个新的研究领域的传感芯片之间的通信。

项目成果

期刊论文数量(48)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
Katsuhiko Nakamura: "A Tactile Sensor Instantaneously Evaluating Friction Coefficients"Proc. TRANSDUCERS'01. Vol.2. 1430-1433 (2001)
Katsuhiko Nakamura:“瞬时评估摩擦系数的触觉传感器”Proc。
  • DOI:
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  • 影响因子:
    0
  • 作者:
  • 通讯作者:
Kouichi Yamada, Kenji Goto, Yoshiki Nakajima, Nobuyoshi Koshida, and Hiroyuki Shinoda: "A Sensor Skin using Wire-Free Tactile Sensing Elements Based on Optical Connection"Proc. SICE 2002. 319-322 (2002)
Kouichi Yamada、Kenji Goto、Yoshiki Nakajima、Nobuyoshi Koshida 和 Hiroyuki Shinoda:“使用基于光学连接的无线触觉传感元件的传感器皮肤”Proc。
  • DOI:
  • 发表时间:
  • 期刊:
  • 影响因子:
    0
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  • 通讯作者:
Mitsuhiro Hakozaki: "Digital Tactile Sensing Elements Communicating through Conductive Skin Layers"Proc. 2002 IEEE Int. Conf. on Robotics & Automation. 3813-3817 (2002)
Mitsuhiro Hakozaki:“通过导电皮肤层进行通信的数字触觉传感元件”Proc。
  • DOI:
  • 发表时间:
  • 期刊:
  • 影响因子:
    0
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  • 通讯作者:
Kouichi Yamada: "Wire-Free Tactile Sensing Element Based on Optical Connection"Proc.IEEJ 19th Sensor Symposium. 433-436 (2002)
Kouichi Yamada:“基于光学连接的无线触觉传感元件”Proc.IEEJ 第 19 届传感器研讨会。
  • DOI:
  • 发表时间:
  • 期刊:
  • 影响因子:
    0
  • 作者:
  • 通讯作者:
K.Nakamura: "A Tactile Sensor Instantaneously Evaluating Friction Coefficients"Proc.TRANSDUCERS '01. 1430-1433 (2001)
K.Nakamura:“瞬时评估摩擦系数的触觉传感器”Proc.TRANSDUCERS 01。
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    0
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SHINODA Hiroyuki其他文献

Noncontact Heat Presentation for Whole Body Using High Intensity Ultrasound
使用高强度超声波对全身进行非接触式热呈现
  • DOI:
  • 发表时间:
    2021
  • 期刊:
  • 影响因子:
    0
  • 作者:
    ZHU Qirong;KAMIGAKI Takaaki;MASUDA Yuichi;FUJIWARA Masahiro;MAKINO Yasutoshi;SHINODA Hiroyuki
  • 通讯作者:
    SHINODA Hiroyuki

SHINODA Hiroyuki的其他文献

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{{ truncateString('SHINODA Hiroyuki', 18)}}的其他基金

Adaptive visual environment as an ultimate form of vision-related universal design
自适应视觉环境作为视觉相关通用设计的终极形式
  • 批准号:
    15K00216
  • 财政年份:
    2015
  • 资助金额:
    $ 10.82万
  • 项目类别:
    Grant-in-Aid for Scientific Research (C)
A study on sensor networking in elastic media based on two-dimensional signal transmission technologies using micro-wave band
基于微波波段二维信号传输技术的弹性介质传感器网络研究
  • 批准号:
    18206046
  • 财政年份:
    2006
  • 资助金额:
    $ 10.82万
  • 项目类别:
    Grant-in-Aid for Scientific Research (A)
Cortical Management of Spatial Resolution in Human Visual System
人类视觉系统空间分辨率的皮层管理
  • 批准号:
    18560039
  • 财政年份:
    2006
  • 资助金额:
    $ 10.82万
  • 项目类别:
    Grant-in-Aid for Scientific Research (C)
A Study on Diffusive Two Dimensional Communication Technologies
扩散二维通信技术研究
  • 批准号:
    15206044
  • 财政年份:
    2003
  • 资助金额:
    $ 10.82万
  • 项目类别:
    Grant-in-Aid for Scientific Research (A)

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