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Development of non-aqueous electrochemical process for new functional materials

新型功能材料非水电化学工艺开发

基本信息

批准号：
13450309
负责人：
AWAKURA Yasuhiro
金额：
$ 7.04万
依托单位：
Kyoto University
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (B)
财政年份：
2001
资助国家：
日本
起止时间：
2001 至 2003
项目状态：
已结题

项目摘要

The electrolytic codeposition of hydrophobic and hydrophilic micron-and nano-sized particles with aluminium from a non-aqueous electrolyte is illustrated. This introductory investigation demonstrates that the feasibility of codeposition of micron-and nano-sized particles from non-aqueous electrolytes. The large degree of codeposition of particles of different hydrophobicity confirms also that the elimination of the hydration force achieved by using non-aqueous electrolytes, suppresses the major limitations experienced in electrolytic codeposition from aqueous electrolytes. These limitations are the agglomeration of particles and the extremely difficulty to achieve, codeposition of hydrophobic particles like SiO_2, Al_2O_3, TiO_2, even the micron-size ones. Composite plating with nano-sized particles from relatively low cost and easily operational non-aqueous electrolytes opens the way towards the development of thin films and coatings with unique functional properties. The feasibility of codepositing particles from non-aqueous solutions opens new fields of applications of composite plating.The electrodeposition of active metals, e.g. Al, Mg, and rare earths, from aqueous media is actually impossible due to their largely negative redox potentials. We developed a new ammonium-imide salt, trimethyl-n-hexylammonium bis ((trifluoromethyl)sulfonyl) amide (TMHA-Tf_2N) and investigated the electrodeposition of Mg and Zn-Mg alloy. Metalic Mg, which cannot be electrodepo sited from aqueous solution, was obtained at -2.8 V or ower potentials. Although the TMHA-Tf_2N liquid is hydrophobic, the deposition of Mg and its alloy was fairly affected by residual water in an electrolytic bath.

说明了从非水电解质中电解共沉积疏水性和亲水性微米和纳米尺寸的颗粒与铝。这一介绍性的研究表明，从非水电解质共沉积微米和纳米尺寸的颗粒的可行性。不同疏水性的颗粒的大程度的共沉积也证实了通过使用非水电解质实现的水合力的消除抑制了在从水性电解质的电解共沉积中经历的主要限制。这些限制是颗粒的团聚和疏水颗粒如SiO_2，Al_2O_3，TiO_2，甚至微米级颗粒的共沉积非常困难。采用成本相对较低且易于操作的非水电解质制备的纳米颗粒复合电镀为开发具有独特功能特性的薄膜和涂层开辟了道路。从非水溶液中共沉积颗粒的可行性为复合电镀的应用开辟了新的领域。由于Al、Mg和稀土等活性金属的氧化还原电位很大程度上为负，从水介质中电沉积这些金属实际上是不可能的。本文合成了一种新的酰亚胺铵盐--三甲基-正己基双（三氟甲基）磺酰）胺铵（TMHA-Tf_2N），并研究了它在镁和锌镁合金电沉积中的作用。在-2.8V或更低的电位下得到了不能从水溶液中电沉积的金属镁。虽然TMHA-Tf_2N电解液是疏水性的，但电解液中残留的水对镁及其合金的沉积有较大的影响。