Production of nano-composite by electrochemical process in new solvent
新溶剂电化学法制备纳米复合材料
基本信息
- 批准号:16360374
- 负责人:
- 金额:$ 9.86万
- 依托单位:
- 依托单位国家:日本
- 项目类别:Grant-in-Aid for Scientific Research (B)
- 财政年份:2004
- 资助国家:日本
- 起止时间:2004 至 2006
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
In this study, we used TMHA-Tf_2N which is a new solvent for electrochemistry, but whose properties has not known well. Thus it is quite important issue to collect basic properties of this new solvent, for example, water content and kinematic viscosity, electrical conductivity were measured. As the results, kinematic viscosity of TMHA-Tf_2N was found to decrease with temperature and water content. On the other hand, the electrical conductivity increased with temperature and water content. As one of method to electroplate Cu-Sn alloy, we carried out electroreduction of Sn on Cu substrate and allowed mutual diffusion to form Cu-Sn alloy. To achieve this method, the diffusion coefficient has to be large. Thus, TMHA-Tf_2N has advantage because it is stable higher temperature than about 100 C, and at the higher temperature, the diffusion coefficient is high. As the results, (1) It was found that tin ion(II) was reduced to metallic tin at a higher voltage than natural voltage of tin electrode by cyclic voltammogram in the higher voltage range than 0 V. (2) Contact galvanic deposition was employed in ionic liquid. Obtained Cu-Sn alloy showed metallic white silver color. The composition of the alloy was Cu_6Sn_5, Cu_3Sn, Cu_<10>Sn_3 It is noted that the rate of film formation was three times larger at 150C than that at 90 C in aqueous solution. This implies the promising properties of this ionic liquid for a higher temperature electroplating method. (3) In potentiostatic electrolysis on Cu substrate, what intermetallic compound formed depends on applied voltage. At voltage lower than +40 mV, metallic wihite slver was obtained but higher than +50mV only black film was obtained. (4) We also applied the galvanic contact method to thin cupper film.
在本研究中,我们使用了TMHA-TF2N,这是一种新的电化学溶剂,但其性质尚不清楚。因此,收集这种新型溶剂的基本性质是非常重要的,例如,测量了水分含量、运动粘度、电导率等。结果表明,TMHA-TF2N的运动粘度随温度和水分的增加而降低。另一方面,电导率随温度和水分的增加而增大。作为电镀铜锡合金的一种方法,我们在铜基上进行了锡的电还原,并允许互扩散形成铜锡合金。要实现这种方法,扩散系数必须很大。因此,TMHA-TF2N在100℃左右的温度下是稳定的,并且在较高的温度下,扩散系数较高,因此具有优势。结果表明:(1)在高于0V的电压范围内,在高于锡电极自然电压的电压下,锡离子(II)被还原为金属锡。(2)在离子液体中采用接触电镀的方法。获得的铜锡合金呈金属白银色。该合金的成分为Cu6Sn5,Cu3Sn10&Gt;Sn3。在150℃时的成膜速率是90℃时的3倍。这表明该离子液体在高温电镀方法中具有良好的应用前景。(3)在铜衬底上进行恒电位电解时,金属间化合物的生成与外加电压有关。当电压低于+40 mV时,获得了金属辉光薄膜,但高于+50 mV时,只得到了黑色薄膜。(4)我们还将电偶接触法应用于薄铜膜。
项目成果
期刊论文数量(13)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
Water content and related physical properties of aliphatic quaternary ammonium imide-type ionic liquid containing metal ions
- DOI:10.1016/j.stam.2006.02.017
- 发表时间:2006-09-01
- 期刊:
- 影响因子:5.5
- 作者:Katase, Takuma;Imashuku, Susumu;Awakura, Yasuhiro
- 通讯作者:Awakura, Yasuhiro
Formation of Cu-Sn Alloy Layer by Contact Deposition Using Quaternary Ammonium Imide Type Ionic Liquid
使用季铵酰亚胺型离子液体通过接触沉积形成Cu-Sn合金层
- DOI:
- 发表时间:2006
- 期刊:
- 影响因子:0
- 作者:T.Katase;et al.;K.Murase et al.;T.Katase et al.;T.Katase et al.;T.Katase et al.
- 通讯作者:T.Katase et al.
Electrochemical Alloying of Cupper Substrate with Tin Using Ionic Liquid as an Electrolyte at Medium-Low Temperatures
中低温下离子液体为电解质对铜基体与锡进行电化学合金化
- DOI:
- 发表时间:2007
- 期刊:
- 影响因子:0
- 作者:T.Yoshioka;Y.Makino;S.Miyake;H.Mori;T.Katase et al.;K.Murase et al.
- 通讯作者:K.Murase et al.
Electrodeposition of Metals from Quaternary Ammonium Imide Type Room Temperature Ionic Liauid
季铵酰亚胺型室温离子液体电沉积金属
- DOI:
- 发表时间:2004
- 期刊:
- 影响因子:0
- 作者:K.Murase;Y.Awakura
- 通讯作者:Y.Awakura
電気鍍金研究会編『次世代めっき技術』
电镀研究组主编《下一代电镀技术》
- DOI:
- 发表时间:2004
- 期刊:
- 影响因子:0
- 作者:K.Murase;Y.Awakura;邑瀬 邦明(分担執筆)
- 通讯作者:邑瀬 邦明(分担執筆)
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AWAKURA Yasuhiro其他文献
AWAKURA Yasuhiro的其他文献
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{{ truncateString('AWAKURA Yasuhiro', 18)}}的其他基金
Ionic electrode for fast oxide ion conductor based on bismuth related oxides
基于铋相关氧化物的快速氧化物离子导体离子电极
- 批准号:
19360344 - 财政年份:2007
- 资助金额:
$ 9.86万 - 项目类别:
Grant-in-Aid for Scientific Research (B)
Development of non-aqueous electrochemical process for new functional materials
新型功能材料非水电化学工艺开发
- 批准号:
13450309 - 财政年份:2001
- 资助金额:
$ 9.86万 - 项目类别:
Grant-in-Aid for Scientific Research (B)
The Structure of Poly-molybdate Ions and It's Relevance to the Electroplating of Molybdenum Alloy
聚钼酸根离子的结构及其与钼合金电镀的关系
- 批准号:
09305052 - 财政年份:1997
- 资助金额:
$ 9.86万 - 项目类别:
Grant-in-Aid for Scientific Research (A)
Studies of Chromium alloy plating on steel
钢镀铬合金的研究
- 批准号:
06650800 - 财政年份:1994
- 资助金额:
$ 9.86万 - 项目类别:
Grant-in-Aid for General Scientific Research (C)
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13440222 - 财政年份:2001
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