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Development of Binderless board

Development of Binderless board
无粘结剂板的开发
批准号:
15580142
负责人:
SATO Masatoshi
金额:
$2.05万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
2003
资助国家:
日本
项目状态:
已结题
起止时间:
2003 至 2005

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项目成果

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中文摘要
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英文摘要
Kenaf binderless board has been developed as one of the effective utilization for Kenaf core part which is one of the abandon biomass resources. As the result, at high pressing temperature the water resistant properties of binderless boards were higher than for boards bonded with urea formaldehyde or urea melamine formaldehyde resins. And it was observed that there was no severe deterioration in the binderless board under the outdoor exposure test for one year.Moreover, thermal softening lignin, chemical bonds formed by free carboxylic acid, and increases in condensed structure in lignin were considered to be playing important role in the self-bonding mechanism. In contrast, furfural and cleavages of intermonomer linkages in lignin during the hot pressing process showed little contribution to the self-bonding.Concerning the manufacturing condition for binderless board, it is suggested that usual board manufacturing condition and device can be applied to produce the binderless board since pressing pressure and temperature is same as that of wood-based materials.In the future, binderless board will be become an important target for effective utilization of biomass waste, especially in developing countries where people have no or limited wood resources and no adequate chemical industries but a surplus of agricultural residues.
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Chemical change of kenaf core binderless boards during hot pressing <II> : effect on the binderless board properties
红麻芯无粘合剂纸板在热压过程中的化学变化<II>:对无粘合剂纸板性能的影响
DOI: --
发表时间: 2006
期刊: Journal of Wood Science Vol.52,No.3(先行オンライン版)
影响因子: --
作者: [Okuda N, Hori K, Sato M]
通讯作者: Sato M
DOI: 10.1007/s10086-005-0761-4
发表时间: 2006-06
期刊: Journal of Wood Science
影响因子: 2.9
作者: [N. Okuda;K. Hori;Masatoshi Sato]
通讯作者: N. Okuda;K. Hori;Masatoshi Sato
Water resistant properties of kenaf core binderless boards.
红麻芯无胶合板的防水性能。
DOI: --
发表时间:
期刊: Journal of Wood Science (in press)
影响因子: --
作者: [Okuda N, Sato M]
通讯作者: Sato M
Water resistant properties of kenaf core binderless boards
红麻芯无胶合板的防水性能
DOI: --
发表时间:
期刊: Journal of Wood Science (in press)
影响因子: --
作者: [Okuda N, Hori K, Sato M]
通讯作者: Sato M
10
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    • 批准号:
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    • 项目类别:
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    • 资助金额:
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    • 财政年份:
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    • 财政年份:
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