MiMoSe - Microelectronic modular system for sensor-integrating machine elements

传感器集成机器元件（SiME）的系统化开发，特别是考虑到严重有限的安装空间、高效的数据管理和自给自足的能源预算，是机电一体化开发领域的一个重大挑战，目前在方法上还没有得到充分的支持。该项目的目的是设计和测试一个基于模型的微电子模块化系统，用于SiME中传感器系统的系统开发，以固定和运动螺钉为例，以便能够从电子模块配置和配置特定应用的传感器系统。这是通过机械、（微）电子、软件和设计方法等不同领域之间的必要合作来实现的。首先，确定传感器集成固定和运动螺钉中传感器系统的机械、电气和几何要求。这些都是在建模语言SysML的需求模型中实现的，作为基于模型的微电子模块化系统的基础。随后，确定满足要求所需的产品特性。随后识别可用的微电子元件，分析其特性，并开发出适合其分类的结构。组件在SysML中建模，具有相关的依赖关系和必要的参数，用于配置和预设计为微电子模块化系统。这种类型的建模使得可以存储不同类型的数据元素，并允许在以后调整以及扩展微电子模块化系统的情况下进行简单的一致性检查。如果将模块化结构转换为合适的配置系统，则可以根据应用组合模块变体，并在SiME中配置传感器系统的不同解决方案。这是在考虑测量任务的相应要求以及机器元件的个别应用和边界条件的情况下完成的。系统配置和设计基于三个新定义的基本策略：针对数据、能源或安装空间进行优化。选择两个传感器系统作为示例，以演示的形式进行原型实现。对于基于模型的模块化系统和配置系统的初始验证，原型实现的传感器系统演示器将分别集成到固定和运动螺钉中。最后，将在静态和动态测试中对实现的SiME原型进行实验检查，以比较传感器系统的测量和预测信号以及应用限制。

The systematic development of sensor-integrating machine elements (SiME), in particular taking into account the severely limited installation space, efficient data management and a self-sufficient energy budget, represents a significant challenge in the field of mechatronic development that is currently not sufficiently supported methodologically. The aim of this project is to design and test a model-based microelectronic modular system for the systematic development of sensor systems in SiME, using the example of fixing and motion screws, in order to be able to configure and predefine application-specific sensor systems from electronic modules. This is to be achieved through the necessary collaboration between the different areas of mechanics, (micro-) electronics, software and design methodology.At the beginning, mechanical, electrical and geometrical requirements for sensor systems in sensor-integrating fixing and motion screws are identified. These are implemented in a requirements model in the modelling language SysML as the basis for the model-based microelectronic modular system. Subsequently, the product characteristics necessary to fulfil the requirements are determined. Available microelectronic components are subsequently identified, analysed with regard to their properties and a suitable structure for their classification is developed. The components are modelled in SysML with the associated dependencies and the necessary parameters for configuration and predesign as a microelectronic modular system. This type of modelling makes it possible to store different types of data elements and allows a simple consistency check in the case of later adjustments as well as the extension of the microelectronic modular system. If the modular structure is transferred to a suitable configuration system, it allows the application-specific combination of module variants and the configuration of different solution alternatives for sensor systems in SiME. This is done taking into account the respective requirements from the measurement task and the individual application and boundary conditions of the machine element. The system configuration and design is based on three newly defined basic strategies: optimised for data-, energy- or installation space. Two sensor systems are selected as examples for prototypical implementation in the form of demonstrators. For an initial verification of the model based modular system and the configuration system, the prototypically realised sensor system demonstrators will each be integrated into a fixing and a motion screw. Finally, the realised SiME prototypes will be experimentally examined in static and dynamic tests to enable a comparison between the measured and predicted signals and application limits of the sensor systems.