What is a controlling factor of the strength of thin films?

薄膜强度的控制因素是什么？

基本信息

批准号：
17560071
负责人：
HANABUSA Takao
金额：
$ 2.24万
依托单位：
The University of Tokushima
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
2005
资助国家：
日本
起止时间：
2005 至 2006
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-17560071/
关键词：
Thin film Nano-size Al film Cu film Residual stress Thermal stress Thermal cycle test ストレスマイグレーション Cu薄膜 Al薄膜保護膜

项目摘要

A deposition of thin films on a substrate and etching process are a principal method in order to fabricate micro machine or nano machine. A construction of film has been changed from a single-layer film to.a multi-layer film to make a three dimensional machine structure. It has been cleared that a large.scale of residual stresses is formed in these thin film structure and these residual stresses will cause a dimensional change in the structure through fabricating stages. The strength of materials constructing a structure is also important and must be investigated. Stress migration is one of the factors that weaken a film structure in a way that an atomic migration due to stress change in the films control a strength of the film. There is a possibility that nano-size and multi-layer film structure increase the strength of films.This program investigated a thermal stress behavior in Al films and Cu films deposited on silicon substrates by synchrotron radiation. The main results are as follows:(1) Thermal stresses in a film, 10, 20 and 50 nm in thickness, deposited on a thermally oxidized silicon film changed in a linear way during thermal cycling from room temperature to 300 deg in C. Al film is strengthened by down sizing to nano-size thickness.(2) Stresses in a 100 nm thick Cu layer of Cu/A1N multi-layer film behaves non-linear change in the first heating cycle but after that stresses behave in a linear way in cooling and heating stages. Cu films strengthen by constructing a multi-layer structure with AlN film.

薄膜在底物和蚀刻过程中的沉积是一种主要方法，以制造微型机器或纳米机器。电影的构造已从单层胶片变为多层胶片，以制作三维机器结构。已经清除了在这些薄膜结构中形成的大量残留应力的大规模，这些残留应力将通过制造阶段导致结构的维度变化。建造结构的材料的强度也很重要，必须进行研究。压力迁移是削弱膜结构的因素之一，以使膜中的压力变化引起的原子迁移控制膜的强度。纳米大小和多层膜结构可能会提高膜的强度。该程序研究了通过同步辐射沉积在硅底物上的Al膜和CU膜中的热应力行为。主要结果如下：（1）膜中的热应力，厚度为10、20和50 nm，沉积在热氧化的硅膜上，在从室温到300度的热循环中以线性方式变化。C。Al膜在Al膜中加强薄膜的增强，通过降低为nano size厚度。第一个加热周期，但在此之后，压力在冷却和加热阶段以线性方式行为。 Cu胶片通过使用ALN膜构建多层结构来增强。