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What is a controlling factor of the strength of thin films?

薄膜强度的控制因素是什么？

基本信息

批准号：
17560071
负责人：
HANABUSA Takao
金额：
$ 2.24万
依托单位：
The University of Tokushima
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
2005
资助国家：
日本
起止时间：
2005 至 2006
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-17560071/
关键词：
Thin film Nano-size Al film Cu film Residual stress Thermal stress Thermal cycle test ストレスマイグレーション Cu薄膜 Al薄膜保護膜

项目摘要

A deposition of thin films on a substrate and etching process are a principal method in order to fabricate micro machine or nano machine. A construction of film has been changed from a single-layer film to.a multi-layer film to make a three dimensional machine structure. It has been cleared that a large.scale of residual stresses is formed in these thin film structure and these residual stresses will cause a dimensional change in the structure through fabricating stages. The strength of materials constructing a structure is also important and must be investigated. Stress migration is one of the factors that weaken a film structure in a way that an atomic migration due to stress change in the films control a strength of the film. There is a possibility that nano-size and multi-layer film structure increase the strength of films.This program investigated a thermal stress behavior in Al films and Cu films deposited on silicon substrates by synchrotron radiation. The main results are as follows:(1) Thermal stresses in a film, 10, 20 and 50 nm in thickness, deposited on a thermally oxidized silicon film changed in a linear way during thermal cycling from room temperature to 300 deg in C. Al film is strengthened by down sizing to nano-size thickness.(2) Stresses in a 100 nm thick Cu layer of Cu/A1N multi-layer film behaves non-linear change in the first heating cycle but after that stresses behave in a linear way in cooling and heating stages. Cu films strengthen by constructing a multi-layer structure with AlN film.

在衬底上沉积薄膜和蚀刻工艺是制造微机械或纳米机械的主要方法。膜的构造已经从单层膜改变为多层膜以制造三维机器结构。已经清楚的是，在这些薄膜结构中形成了大规模的残余应力，并且这些残余应力将在整个制造阶段引起结构中的尺寸变化。构造结构的材料的强度也很重要，必须进行研究。应力迁移是以由于膜中的应力变化引起的原子迁移控制膜的强度的方式削弱膜结构的因素之一。纳米尺寸和多层膜结构有可能提高薄膜的强度。本计划研究了用同步辐射沉积在硅衬底上的Al膜和Cu膜的热应力行为。主要结果如下：（1）在热氧化硅膜上沉积的10、20和50 nm厚的薄膜，在从室温到300 ℃的热循环过程中，薄膜中的热应力呈线性变化。铝膜通过减小尺寸至纳米尺寸厚度而得到强化。(2)Cu/A1 N多层膜中100 nm厚Cu层的应力在第一次加热循环中表现为非线性变化，之后在冷却和加热阶段表现为线性变化。Cu膜通过与AlN膜构成多层结构而得到强化。