Ultimate Materials and Processes for Integrated Intelligent System

(1)Best quality SiGe material in the world was fabricated by a gas-source MBE technology to which substantially precipitation free technology was introduced.Based on the SiGe heterogeneous junction with high emission efficiency and the well-controlled quantum dots which were achieved by this technology provided2000 and 1700 for electron and hole mobilities at the room temperature，respectively。These results allowed us to give a prospect for the SiGe FET fabrication.(2)Thermally grown oxide of the hydrogen-terminated Si(100)at 900℃demonstrated roughness of about one atomic step。Furthermore，it was found that the roughness changed periodically with increase in the oxidation time and this corresponded exactly to the periodic variations of the surface state density distribution.In the case of the excited oxygen active species，atomically-controlled ultra-thin Si oxide with thickness of 2 6 nm was grown at low temperatures of 300-500℃.Then it was found that a new planarization mec…More hanism in which the reaction of the active species was self-limited。(3)“Defect-active Processing”was proposed and confirmed。This utilizes the rearrangement effect of atoms induced during relaxation process of non-equilibrium point defects introduced to crystals，thereby leading to defect-free crystallization.(4)Contact holes with 0.15µm diameter and aspect ratio of 15were engraved without microloading till 70 nm employing substituting fluorocarbon gases.Conversion of higher order fluorocarbon radicals to lower ones at higher temperature inner wall was also found。Native oxide grown on the hole bottom Si surface Si was removed successfully by hot NF I D 23 I D 2/HN I D 23 I D 2 mixture.(5)Insertion of a SiGe layer into a Ti/Si interface reduced contact resistance to two order lower values for both n and p types.(6)A novel device which consisted of dielectric/magnetic layered films allowed us to transfer optical information detected by a organic film layer to a spin information of the magnetic-semiconductor and electric conduction information via polarixation of a ferroelectric。(7)A molecular design supporting system which enabled us to design the device fabrication process at a molecular level was developed，and this application elucidated successfully dynamic behaviors of various processes。Furthermore，a theoretical method based on a quantum chemistry led to systematic understanding of thermal decomposition of SiH I D24齐埃D2 on the hydrogen-terminated Si surface and elemental reaction process of the Cu CVD.(8)动态Threshold MOS(EIB-DTMOS)structure which had the large substrate biasing constant was proposed and it demonstrated the two times larger current drivability as compared with the conventional FET.Less：Less

(1) Best quality SiGe material in the world was fabricated by a gas-source MBE technology to which substantially precipitation free technology was introduced. Based on the SiGe heterogeneous junction with high emission efficiency and the well-controlled quantum dots which were achieved by this technology provided 2000 and 1700 for electron and hole mobilities at the room temperature, respectively. These results allowed us to give a prospect for the SiGe FET fabrication. (2) Thermally grown oxide of the hydrogen-terminated Si(100) at 900℃ demonstrated roughness of about one atomic step. Furthermore, it was found that the roughness changed periodically with increase in the oxidation time and this corresponded exactly to the periodic variations of the surface state density distribution. In the case of the excited oxygen active species, atomically-controlled ultra-thin Si oxide with thickness of 2 6nm was grown at low temperatures of 300-500℃. Then it was found that a new planarization mec … More hanism in which the reaction of the active species was self-limited. (3) "Defect-active Processing" was proposed and confirmed. This utilizes the rearrangement effect of atoms induced during relaxation process of non-equilibrium point defects introduced to crystals, thereby leading to defect-free crystallization. (4) Contact holes with 0.15μm diameter and aspect ratio of 15 were engraved without microloading till 70nm employing substituting fluorocarbon gases. Conversion of higher order fluorocarbon radicals to lower ones at higher temperature inner wall was also found. Native oxide grown on the hole bottom Si surface Si was removed successfully by hot NFィイD23ィエD2/HNィイD23ィエD2 mixture. (5) Insertion of a SiGe layer into a Ti/Si interface reduced contact resistance to two order lower values for both n and p types. (6) A novel device which consisted of dielectric/magnetic layered films allowed us to transfer optical information detected by a organic film layer to a spin information of the magnetic-semiconductor and electric conduction information via polarixation of a ferroelectric. (7) A molecular design supporting system which enabled us to design the device fabrication process at a molecular level was developed, and this application elucidated successfully dynamic behaviors of various processes. Furthermore, a theoretical method based on a quantum chemistry led to systematic understanding of thermal decomposition of SiHィイD24ィエD2 on the hydrogen-terminated Si surface and elemental reaction process of the Cu CVD. (8) Dynamic Threshold MOS (EIB-DTMOS) structure which had the large substrate biasing constant was proposed and it demonstrated the two times larger current drivability as compared with the conventional FET. Less