Study on Diffusion Bonding of Oxide Dispersion Strengthened Alloy
氧化物弥散强化合金扩散连接研究
基本信息
- 批准号:01850167
- 负责人:
- 金额:$ 11.2万
- 依托单位:
- 依托单位国家:日本
- 项目类别:Grant-in-Aid for Developmental Scientific Research (B).
- 财政年份:1989
- 资助国家:日本
- 起止时间:1989 至 1990
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
This study was carried out in order to join the oxide dispersion strengthened alloy, MA956 (Fe-19Cr-4.5Al-0.5Y_2O_3) and MA754 (Ni-20%Cr-0.6%Y_2O_3) by using Transient Liquid Insert Metal Diffusion Bonding (TLIM-bonding) technique. New insert metal was developed for MA956 and then mechanical properties of bonded joints were evaluated. Surface alloyed MA754 were bonded and then metallographic examination was carried out. Ion plating method was used for surface alloying of MA754. Main results obtained are as follows.(1) The new insert metal (IM-7) containing 7%Si and 1%B with the base metal was developed. Base metal was bonded at the temperature of 1563K for 2.16ks with the IM-7 insert metal and as a result, sound joints were obtained at this bonding condition.(2) The hardness and the contents of alloying elements in the bonded interlayer were almost equal to those in the base metal.(3) This joint was too brittle at room temperature due to aluminum oxide lined on the bonded interface and fractured at the bonded interface. However, the mechanical properties of this joint at 923K was equal to those of just base metal. This joint fractured at the base metal.(4) Uniform boron films were deposited on Ni and MA754 base metal by Ion plating method at a bias voltage of -200V, gas pressure of 66.7mPa and a substrate temperature of 573K.(5) Bonding time for Ni with boron film thickness of 0.3mum was extremely short at 1473K.(6) It was difficult to eliminate void ratio in the bonded interlayer of MA754 joint.
采用瞬时液相插入金属扩散连接技术对氧化物弥散强化合金MA 956(Fe-19 Cr-4.5Al-0.5Y_2O_3)和MA 754(Ni-20%Cr-0.6%Y_2O_3)进行连接。为MA 956开发了新的镶块金属,并对胶接接头的力学性能进行了评价。对表面合金化的MA 754钢进行了焊接,并进行了金相检验。采用离子镀方法对MA 754进行表面合金化处理。主要结果如下。(1)研制了含7%Si和1%B的IM-7新型镶齿金属。母材与IM-7镶块在1563 K的温度下进行了2.16ks的连接,结果表明,在此连接条件下获得了良好的接头。(2)中间层的硬度和合金元素含量与母材相当。(3)该接头在室温下太脆,这是由于氧化铝内衬在结合界面上,并在结合界面处断裂。然而,在923 K下,该接头的力学性能与仅母材的力学性能相当。这个接头在母材处断裂。(4)在偏压为-200V、气压为66.7mPa、衬底温度为573 K的条件下,用离子镀方法在Ni和MA 754基体上沉积了均匀的硼薄膜。(5)在1473 K下,硼膜厚度为0.3 μ m的Ni的键合时间极短。(6)MA 754接头粘结层孔隙率难以消除。
项目成果
期刊论文数量(3)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
Yoshikuni NAKAO and Kenji SHINOZAKI: "Study on Transient Liquid Insert Metal Diffusion Bonding of Oxide Dispersion Strengthened Alloy (Part 1)" Preprints of National Meeting of J. W. S.No. 47. 206 (1990)
Yoshikuni NAKAO和Kenji SHINOZAKI:“氧化物弥散强化合金的瞬态液体插入金属扩散连接研究(第1部分)”J.W.S.No.全国会议预印本
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- 影响因子:0
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中尾 嘉邦,篠崎 賢二: "MA956合金のインサ-トメタルの開発ー酸化物分散強化合金の液相インサ-ト金属拡散接合に関する研究(第1報)ー" 溶接学会全国大会講演概要. 47. 206-207 (1990)
Yoshikuni Nakao、Kenji Shinozaki:“MA956 合金嵌件金属的开发 - 氧化物弥散强化合金的液相嵌件金属扩散接合研究(第 1 次报告)-”全国焊接学会会议上的演讲摘要。 47. 206-207 (1990)
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NAKAO Yoshikuni其他文献
NAKAO Yoshikuni的其他文献
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$ 11.2万 - 项目类别:
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