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Clarification of electronic properties of polymer-inorganic material interface and development of insulating composite materials for higher fields

阐明高分子-无机材料界面的电子特性及开发更高领域的绝缘复合材料

基本信息

批准号：
02650209
负责人：
KAWAMOTO Akira
金额：
$ 0.7万
依托单位：
Fkui National Collge of Technology
依托单位国家：
日本
项目类别：
Grant-in-Aid for General Scientific Research (C)
财政年份：
1990
资助国家：
日本
起止时间：
1990 至 1991
项目状态：
已结题

项目摘要

In practical insulating systems, polymer is used mostly in the form of a composite with fillers, it is important to study electronic properties of polymer-filler interface at high fields. in this study, the author used epoxy-alumna and epoxy-silica two-layer composite films as model systems to investigate the effect of a polymer-filler interface on electronic conduction by measuring photocurrents and thermally stimulated currents (TSC). The main conclusions obtained in this research are summarized as follows.(1) Holes transported from the epoxy layer in epoxy-alumina compositesAt high fields and low temoprature, most of holes in the epoxy layer can pass through the epoxy-alumina interface and move in the alumina bulk, increasing the conduction current in the alumina. This interfacial phenomenon can not be explained by the conventional Maxwell-Wagner model. At high fields and room temperature, the pohotoconduction is governed by the almina layer. These are well explained by the Maxwell- … More Wagner model.(2) Holes transported from the alumina layer in epoxy-alumina compositeAt low fields and low temperature, holes in alumina layer can pass through the interface and increase the conduction current in the epoxy. On the other hand, at high fields, photoconduction is well explained by the Maxwell-Wagner model. At room temperature, transport of the carriers from the alumina layer is blocked by the potential barrier at the interface and many of hole are trapped at the interface.(3) Holes transported from the epoxy layer in epoxy-silica compositesSimilar measurements were carried out on epoxy-silica composites. The same phenomena which can not be explained by the Maxwell-Wagner model as in the epoxy-alumina compoites were also observed in epoxy-silica composites at low and room temoerature. TSC measurements showed that holes were scarcely accumulated at the epoxy-silica interface. On the othe hand, most of electrons from the epoxy layer can pass through the interfece and increase the conduction in silica region.As seen from the above results, the electrical properties of epoxy-filler composites are greatly affected by the interfaces in various ways depending on applied field, temperature, carrier species, direction of carriers, mechanical stress and so on. Less

在实际的绝缘体系中，聚合物主要以与填料复合的形式使用，研究高电场下聚合物-填料界面的电学性质具有重要意义。本研究以环氧树脂-氧化铝和环氧树脂-二氧化硅双层复合膜为模型体系，通过测量光电流和热刺激电流（TSC），研究了聚合物-填料界面对电子传导的影响。本研究取得的主要结论归纳如下。(1)环氧树脂-氧化铝复合材料中环氧树脂层的空穴输运在高场低温下，环氧树脂层中的大部分空穴可以穿过环氧树脂-氧化铝界面，在氧化铝块体中移动，增加了氧化铝中的传导电流。这种界面现象不能用传统的Maxwell-Wagner模型来解释。在高场和室温下，光电导由氧化铝层控制。麦克斯韦很好地解释了这些- ...更多信息瓦格纳模型。(2)环氧树脂-氧化铝复合材料中氧化铝层的空穴传输在低场和低温下，氧化铝层中的空穴可以穿过界面，增加环氧树脂中的传导电流。另一方面，在高场，光电导很好地解释了麦克斯韦-瓦格纳模型。在室温下，载流子从氧化铝层的输运被界面处的势垒阻挡，并且许多空穴被捕获在界面处。(3)环氧树脂-二氧化硅复合材料中环氧树脂层的空穴传输在环氧树脂-二氧化硅复合材料上进行了类似的测量。在低温和室温下，在环氧树脂-二氧化硅复合材料中也观察到了与环氧树脂-氧化铝复合材料中相同的现象，这些现象无法用Maxwell-Wagner模型解释。TSC测量结果表明，几乎没有积累在环氧树脂-二氧化硅界面的空穴。另一方面，环氧树脂层中的大部分电子可以通过界面，增加二氧化硅区的导电性，由此可见，界面对环氧树脂-填料复合材料的电性能有很大的影响，其影响方式与外加电场、温度、载流子种类、载流子方向、机械应力等有关。