Structural Analysis of Solid/Liquid Interfaces by Using UHV-EC STM Combining Systems

1995年，我们构建并改进了我们的固/液界面分析仪器。该分析系统可用于1)方便地比较原位电化学STM和非原位特高压- ec组合系统获得的结果；2)对在特高压下制备和定义的单晶样品进行原位电化学STM测量。1996年，我们利用这些仪器进行了以下调查。1)电解质溶液中碘对Pt（111）、Au（111）和Ag（111）吸附结构的结构分析。在Pt（111）上，碘根据浸渍电位形成（3x3）或（ROO<7>xROO<7>）R19.1的结构。在Au（111）和Ag（111）上，碘根据溶液中施加的电极电位表现出连续的结构变化。2)研究了Pd（111）、（100）和（110）电极表面的电化学刻蚀。在原子尺度上的蚀刻过程通过结合系统被理解。3)在特高压条件下制备Ni（100）和Ni（111）表面，然后将其放入溶液中进行原位STM测量，不受污染。Ni表面在溶液中表现为（100）和（111）结构。并对蚀刻工艺进行了研究。

In 1995, we constructed and improved our instruments for the analysis of solid/liquid interfaces. The analyical systems are for 1) easily comparing the results obtained by in-situ electrochemical STM and ex-situ UHV-EC combining system and for 2) in-situ electrochemical STM measurements on the single crystal samples prepared and defined under UHV.In 1996, by using these instruments, We carried out the following investigations. 1) Structural analysis of the adsorption structures of iodine on Pt(111), Au(111), and Ag(111) in electrolyte solutions. On Pt(111), iodine formes (3x3) or (ROO<7>xROO<7>)R19.1ﾟ structure according to the immersion potentials. On Au(111) and Ag(111), iodine exibites continuous structural change according to the applied electrode potentials in solutions. 2) Electrochemical etching of Pd(111), (100), and (110) electrode surfaces were examined. The etching process in an atomic scale was understood by the combining system. 3) Ni(100) and (111) surfaces were prepared under UHV,and they were subsequently brought into solutions for in-situ STM measurements without polution. Ni surfaces showed (100) and (111) structures in solutions. The etching processes were also examined.