Structural Analysis of Solid/Liquid Interfaces by Using UHV-EC STM Combining Systems

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In 1995, we constructed and improved our instruments for the analysis of solid/liquid interfaces. The analyical systems are for 1) easily comparing the results obtained by in-situ electrochemical STM and ex-situ UHV-EC combining system and for 2) in-situ electrochemical STM measurements on the single crystal samples prepared and defined under UHV.In 1996, by using these instruments, We carried out the following investigations. 1) Structural analysis of the adsorption structures of iodine on Pt(111), Au(111), and Ag(111) in electrolyte solutions. On Pt(111), iodine formes (3x3) or (ROO<7>xROO<7>)R19.1ﾟ structure according to the immersion potentials. On Au(111) and Ag(111), iodine exibites continuous structural change according to the applied electrode potentials in solutions. 2) Electrochemical etching of Pd(111), (100), and (110) electrode surfaces were examined. The etching process in an atomic scale was understood by the combining system. 3) Ni(100) and (111) surfaces were prepared under UHV,and they were subsequently brought into solutions for in-situ STM measurements without polution. Ni surfaces showed (100) and (111) structures in solutions. The etching processes were also examined.