Development of In-Process Ultrasonic Measurement For Quality Assurance of Microjoints in Electronic Devices

用于电子设备微接头质量保证的过程中超声波测量的开发

• 批准号: 07650148
• 负责人: SATONAKA Shinobu
• 金额: $ 1.41万
• 依托单位: Kumamoto University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 1995
• 资助国家: 日本
• 起止时间: 1995 至 1996
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-07650148/
• 关键词: Ultrasound; Electronic Device; Microjoint; Capillary; Wire Bonding; Die Bonding; Push Test; Bonding Strength; 遅延材

In the assembly process of electronic devices, many bonding techniques are applied to the small area or thin layr, in which poor bonding may result in electrical failures. Therefore, in-line or in-process testing of micro bonded area are demanded for the quality assurance of electronic devices. However, there are few techniques applicable to the micro bonded area. In this study, two methods are proposed for the non-destructive evaluation of small or thin bonded area in the microcircuit. First method is the ultrasonic testing of wire bonded area with a delay line. Another one is the ultrasonic testing of die bonding with a focused probe. The results obtained are as follows.1.Ultrasonic testing of wire bonding with a delay lineAn ultrasonic testing with delay line is proposed, in which a bonding tool or capillary is used for the delay line and is connected to the probe. In this method, the reflected wave through the capillary indicates proportional amplitude change to the fracture load i … More n the push test. Since the fracture load corresponds to the wire bonding state, this method enables the non-destructive evaluation of wire bonding. Although the reflected wave depends upon the measuring pressure, contact of capillary with probe and couplant, the same condition of measuring pressure to bonding process suggests that this method is applicable to the in-process measurement of wire bonding.2.Ultrasonic testing of die bonding with a focused probeA newly developed ultrasonic testing with a focused probe is applied to the die bonded area, where the paste is supplied in the thin layr between 0.15 mm thick substrate and 0.29 mm thick microcircuit. Under the measuring condition of shorter water path than the focal length of ultrasonic beam, the interface echo reflected from the interface between the substrate and paste is detected with an observable time delay behind surface echo. The interface echo in the scanning indicates the corresponding amplitude change to the lack of paste as well as the debonding. The measurement in the volatile liquid prevents the microcircuit from the corrosion and absorption of water, and shows the same results in the water. The ultrasonic testing in the volatile liquid is available to the in-line measurement of micro devices. Less

在电子器件的组装过程中，许多键合技术应用于小面积或薄层，其中不良键合可能导致电气故障。因此，为了保证电子器件的质量，需要对微接合区域进行在线或过程中测试。然而，适用于微粘合区域的技术很少。在这项研究中，提出了两种方法对微电路中小或薄的粘合区域进行无损评估。第一种方法是使用延迟线对引线接合区域进行超声波测试。另一种是使用聚焦探头对芯片键合进行超声波测试。得到的结果如下： 1.延迟线引线键合的超声波测试 提出了一种延迟线超声波测试方法，延迟线采用键合工具或毛细管，并与探头连接。在这种方法中，通过毛细管的反射波表示推力测试中与断裂载荷成比例的幅度变化。由于断裂载荷与引线键合状态相对应，因此该方法可以对引线键合进行无损评估。虽然反射波取决于测量压力、毛细管与探针和耦合剂的接触，但测量压力与键合过程的相同条件表明该方法适用于引线键合的过程中测量。2.使用聚焦探针进行芯片键合的超声波测试新开发的使用聚焦探针的超声波测试应用于芯片键合区域，其中在0.15之间的薄层中提供焊膏。 毫米厚的基板和 0.29 毫米厚的微电路。在水路比超声波束焦距短的测量条件下，从基材和浆料之间的界面反射的界面回波在表面回波之后可观察到的时间延迟被检测到。扫描中的界面回波表明了缺焊以及脱粘所对应的幅度变化。在挥发性液体中的测量可以防止微电路受到水的腐蚀和吸收，在水中也显示出相同的结果。挥发性液体中的超声波检测可用于微型器件的在线测量。较少的

项目成果

里中 忍: "集束探触子を利用したダイボンディング部の超音波探傷" 日本機械学会第4回機械材料・材料加工技術講演会講演論文集. 121-122 (1996)

Shinobu Satonaka：“使用聚焦探头对芯片接合部件进行超声波探伤”日本机械工程学会第四届机械材料和材料加工技术会议论文集 121-122（1996）。

Shinobu SATONAKA: "Ultrasonic Examination of Die Bonded Joint in Semiconductor with a Focused Probe" The 4th Materials and Processing Conference (M & P'96). 121-122 (1996)

Shinobu SATONAKA：“使用聚焦探头对半导体芯片粘合接头进行超声波检查”第四届材料与加工会议（M）