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Improvement of Thermoelectric Properties of Iron Disilicide by Plasma Processing and Its Relation with Microstructure

Improvement of Thermoelectric Properties of Iron Disilicide by Plasma Processing and Its Relation with Microstructure
等离子体处理改善二硅化铁热电性能及其与微观结构的关系
批准号:
07680534
负责人:
MIKI Toshikatsu
金额:
$1.47万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
1995
资助国家:
日本
项目状态:
已结题
起止时间:
1995 至 1996

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中文摘要
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英文摘要
To improve the thermoelectric figure-of-merit of FeSi_2 and SiGe ceramics, we have employed rf-plasma processing of micrograins prior to sintering. Either SiH_4 or GeH_4 were used as plasma gas for processing. The plasma processed grains were sintered by the ordinary method and the thermoelectric properties of the resultant ceramic specimens were measured. The experimental results are shown in the followings :(1) Plasma-processed ceramics shows electrical conductivity higher than non-processed ceramics. This conductivity increase occurs by either SiH_4 or GeH_4 plasma processing. The Hall measurements revealed that the conductivity increase is mainly due to the increase of carrier mobility.(2) Electron paramagnetic resonance study indicates that some paramagnetic centers are annihilated by plasma processing. The conductivity increase is probably due to the decrease of potential barrier height at grain boundaries.(3) In case of SiH_4 plasma processing, no significant change was oberved in thermal conductivity. However, GeH_4 plasma processing reduces the thermal conductivity.(4) The effect of plasma procesisng on Seebeck coefficient is somewhat complicated, but in most cases plasma processing increases the Seebeck.(5) The effects of plasma processing described above are observed not only for FeSi_2 but also SiGe ceramics.On the basis of these experimental results, we can summarize the effect of plasma processing on FeSi_2 and SiGe ceramics as follows.(1) Plasma processing and resulting microstructure modification improve the thermoelectric properties of FeSi_2 and SiGe ceramics by factor 2 or 3.(2) SiH_4 plasma processing is effective to the electrical conductivity improvement, but GeH_4 plasma processing primarily contributes to the decrease of thermal conductivity. Therefore, it is expected that plasma processing with suitably mixed SiH_4 and GeH_4 gases further improves the themoelectric properties.
期刊论文(17)
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会议论文
K.Kishimoto, Y.Nagamoto, T.Miki, T.Koyanagi and K.Matsubara: "Thermoelectric properties of SiGe ceramics sintered with GeH_4 plasma processed micrograins" Proc.14th Int.Conf.Thermoelectrics. 274-276 (1995)
K.Kishimoto、Y.Nagamoto、T.Miki、T.Koyanagi 和 K.Matsubara:“用 GeH_4 等离子体处理的微晶粒烧结的 SiGe 陶瓷的热电性能”Proc.14th Int.Conf.Thermoelectrics。
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通讯作者:
K.Kishimoto,他5名: "Microstructure control of FeSi_2 ceramics by rf-plasma processing in SiH_4 and GeH_4" AlP Conference Procedings. 316. 123-126 (1995)
K. Kishimoto 和其他 5 人:“SiH_4 和 GeH_4 中射频等离子体处理对 FeSi_2 陶瓷的微观结构控制”AlP 会议记录,316. 123-126 (1995)。
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岸本堅剛,他2名: "プラズマプロセス技術による熱電変換材料の微細構造制御" 材料科学. 33巻. 54-60 (1996)
Kengo Kishimoto 等人:“使用等离子体处理技术的热电转换材料的精细结构控制”材料科学卷 33. 54-60 (1996)。
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T.Miki,他3名: "Effect of intergrain defects on thermoelectric properties of FeSi_2" Proceedings of 14th lnternational Conferece on Thermoelectircs. 227-230 (1995)
T.Miki 等 3 人:“晶间缺陷对 FeSi_2 热电性能的影响”第 14 届国际热电学会议论文集 227-230 (1995)。
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