权益分类	功能权益	普通用户	{{item.name}}会员
{{category.name}}	{{benefitItem.name}}

Study on Development and Application of Intelligent Structure with Smart Materials

智能材料智能结构开发及应用研究

基本信息

批准号：
08045029
负责人：
CHONAN Seiji
金额：
$ 3.97万
依托单位：
TOHOKU UNIVERSITY
依托单位国家：
日本
项目类别：
Grant-in-Aid for international Scientific Research
财政年份：
1996
资助国家：
日本
起止时间：
1996 至 1998
项目状态：
已结题

项目摘要

The purpose of this project is to development a practical and quantitative structural health monitoring technique for intelligent structure system. Since the piezoelectric actuator can be driven at very high frequency and the piezoelectric sensor is very sensitive to the rate of strain changes, the piezoceramic patches structures were introduced as actuators and sensors to generate and receive a high frequency wave propagating in the structure. Since the electromechanical coupling between the piezoelectric material and the structure the physical changes in the structure can be captured efficiently by monitoring the PZT electric impedance this technique is very sensitive to detect the presence of incipient-type damage such as small cracks or loose connections. Furthermore an advanced technique for assessment of the location and characterization of damages by measuring longitudinal wave propagation was developed. In order to reduce the numbers of the PZT patches in the structure for cuffing down the cost of wiring, the technique how to reducing piezoelectric patches in the structure was also investigated. The obtained results have been presented at the SPIE's 6th Annual International Symposium on Smart Structures and Materials.Further, a real time cutting condition monitoring system on slicing 300mm silicon ingot was also developed because the silicon ingot should be cut to yield wafers surface as flat and smooth as possible. The circumferential, radial and normal cutting forces were measured by using the piezoelectric 3-axis load sensor fixed onto the mount of the silicon ingot. The results show that the cuffing condition of the saw blade is clearly predicted by analyzing the high-frequency signal with FFT and wavelet transforms, and the on-line monitoring system is validated experimentally useful for evaluation of 300mm silicon ingot slicing machine.

该项目的目的是开发一种实用的、定量的智能结构系统结构健康监测技术。由于压电致动器可以以非常高的频率驱动，并且压电传感器对应变变化率非常敏感，因此引入压电陶瓷贴片结构作为致动器和传感器，以生成和接收在结构中传播的高频波。由于压电材料和结构之间存在机电耦合，因此可以通过监测 PZT 电阻抗来有效捕获结构中的物理变化，因此该技术对于检测是否存在初期类型损坏（例如小裂纹或松动连接）非常敏感。此外，还开发了一种通过测量纵波传播来评估损伤位置和表征的先进技术。为了减少结构中PZT贴片的数量以降低布线成本，还研究了减少结构中压电贴片的技术。所获得的结果已在SPIE第六届智能结构与材料国际研讨会上公布。此外，由于硅锭的切割应使晶圆表面尽可能平坦和光滑，因此还开发了用于切片300mm硅锭的实时切割状态监测系统。使用固定在硅锭底座上的压电三轴负载传感器测量周向、径向和法向切削力。结果表明，通过FFT和小波变换对高频信号进行分析，可以清晰地预测锯片的切边情况，并通过实验验证在线监测系统可用于300mm硅锭切片机的评估。