Evaluation of Wettability for Microelectronics Materials Based on Dynamic Wetting Model

1.对接触角和动态现象进行了分析，利用新引进的PC机实现了力和接触角的连续测量集成系统的自动控制。通过弯月面轮廓和力-时间曲线计算接触角和表面张力，考虑了其动态现象。并对拉普拉斯方程在平衡态下的适用性进行了比较判断。考虑固液界面流动和润湿运动引起的边界条件变化，进行了基于动态润湿模型的热模拟三维热分析。阐明了润湿性评价试验方法的适用性，以及润湿性评价体系、样品和焊膏的适用性要求，并对评价的适用性进行了判断。重点阐述了零点漂移现象、评价参数的有效性、侧向润湿时间阈值、焊膏体积以及电镀对润湿性的改善。

Research was conducted in this year as follows.1.Analysis of contact angle and dynamic phenomena Automatic control of continuos measurement of force and contact angle by integrated system was done by newly introduced personal computer. Calculating contact angle and surface tension through meniscus contour and force-time curve, its dynamic phenomena was considered. Moreover applicability of Laplace's equation under equilibrium state was judged in comparison.2. Thermals simulation 3-dimensional thermal analysis based on dynamic wetting model was done by considering boundary condition change because of solid-liquid interface movement by flow and wetting.3. Clarification of applicability as wetting evaluation test method Requirements as proper evaluation system of wettability and those of specimen and solder paste were clarified, and applicability of the evaluation was judged. Especially zero-shift phenomena, validity of evaluation parameter, threshold of side wetting time, volume of solder paste, and wetting improvement by plating were clarified.