Evaluation of Wettability for Microelectronics Materials Based on Dynamic Wetting Model

基于动态润湿模型的微电子材料润湿性评价

• 批准号: 11650744
• 负责人: YASUDA Kiyokazu
• 金额: $ 2.3万
• 依托单位: Osaka University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 1999
• 资助国家: 日本
• 起止时间: 1999 至 2000
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-11650744/
• 关键词: Wettability; Micro soldering; Wetting balance method; Reflow soldering; Solder paste; Surface mount; Solderability; Contact angle; リフローソルダリング

Research was conducted in this year as follows.1.Analysis of contact angle and dynamic phenomena Automatic control of continuos measurement of force and contact angle by integrated system was done by newly introduced personal computer. Calculating contact angle and surface tension through meniscus contour and force-time curve, its dynamic phenomena was considered. Moreover applicability of Laplace's equation under equilibrium state was judged in comparison.2. Thermals simulation 3-dimensional thermal analysis based on dynamic wetting model was done by considering boundary condition change because of solid-liquid interface movement by flow and wetting.3. Clarification of applicability as wetting evaluation test method Requirements as proper evaluation system of wettability and those of specimen and solder paste were clarified, and applicability of the evaluation was judged. Especially zero-shift phenomena, validity of evaluation parameter, threshold of side wetting time, volume of solder paste, and wetting improvement by plating were clarified.

1.接触角及动力学现象的分析采用新引进的个人计算机实现了力和接触角连续测量的自动控制。通过弯月面轮廓和力-时间曲线计算接触角和表面张力，考虑了其动力学现象。并通过比较判断了平衡态下拉普拉斯方程的适用性.热模拟基于动态润湿模型进行了三维热分析，考虑了流动和润湿引起的固液界面移动引起的边界条件变化.作为润湿性评价试验方法的适用性的说明作为润湿性的适当评价系统以及试样和焊膏的评价系统的要求进行了说明，并对评价的适用性进行了判断。特别是零移现象，评价参数的有效性，侧润湿时间的阈值，焊膏的体积，并通过电镀改善润湿澄清。

项目成果

安田清和,赤永秀明,藤本公三,仲田周次: "リフロー現象のIn-situ観察に基づくぬれ挙動の実験的検討"第7回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集. 7. 363-368 (2001)

Kiyokazu Yasuda、Hideaki Akanaga、Kozo Fujimoto、Shuji Nakata：“基于回流现象原位观察的润湿行为的实验研究”第七届电子微接合和封装技术研讨会论文集 7. 363-368 (2001)。

K.Yasuda, et. al.: "Evaluation of Wettability for Microelectronic Materials by Reflow-mode Wetting Balance Test"Proc.26th IEEE/CPMT International Electronics Manufacturing Technology Symposium IEMT 2000, Santa Clara, Oct.. 247-252 (2000)

K.安田，等。

K.Yasuda,T.Kitada,K.Fujimoto,S.Nakata: "Numerical Analysis of Meniscus Geometry and Wetting Force for Wettability Evaluation in Reflow-mode Wetting Balance Test"Proc.3rd International Conference "Micro Materials 2000", Berlin, April 2000. 3. 430-433 (2000

K.Yasuda、T.Kitada、K.Fujimoto、S.Nakata：“回流焊模式润湿平衡测试中用于润湿性评估的弯液面几何形状和润湿力的数值分析”Proc.3rd 国际会议“Micro Materials 2000”，柏林，4 月

K.Yasuda,H.Ahamlzu F.Fujimoto,S.Nakata: "Evaluation of Wettability for Microelectronic Materials by Reflow-mode Wetting Balance Test"Proc.26th IEEE/CPMT International Electronics Manufacturing Technology Symposium IEMT 2000. 26. 247-252 (2000)

K.Yasuda,H.Ahamlzu F.Fujimoto,S.Nakata：“通过回流模式润湿平衡测试评估微电子材料的润湿性”Proc.26th IEEE/CPMT 国际电子制造技术研讨会 IEMT 2000. 26. 247-252 (

K.Yasuda,H.Akamizu,K.Fujimoto,S.Nakata: "Evaluation of Wettability for Microelectronic Materials by Reflow-mode Wetting Balance Test"Proc.26th IEEE/CPMT International Electronics Manufacturing Technology Symposium IEMT 2000,Santa Clara, Oct.2000. 26. 247-

K.Yasuda、H.Akamizu、K.Fujimoto、S.Nakata：“通过回流模式润湿平衡测试评估微电子材料的润湿性”Proc.26th IEEE/CPMT 国际电子制造技术研讨会 IEMT 2000，圣克拉拉，10 ​​月