Clarification and Emergence of Self-replication Phenomena in Microelectronic Materials
Clarification and Emergence of Self-replication Phenomena in Microelectronic Materials
批准号:
20560671
负责人:
YASUDA Kiyokazu
金额:
$3.0万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
2008
资助国家:
日本
项目状态:
已结题
起止时间:
2008 至 2010
中文摘要
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英文摘要
In order to make a batch of multi-point fine bumps (protruding electrodes) as the fundamental electrode structure of electronic devices, self-formation method was conducted. With a micro optical recording by a CCD camera, the observation of the wetting behavior of fine molten droplets on metal electrodes and morphological evaluation of bumps were conducted for the proper condition of the self-formation process.
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低融点はんだ-高分子混合系における巨視的自己形成プロセスの解析
低熔点焊料-聚合物混合物体系宏观自形成过程分析
DOI:
--
发表时间:
2010
期刊:
第20回マイクロエレクトロニクスシンポジウム論文集
影响因子:
--
作者:
[T.Baba, K.Hirogaki, I.Tabata, S.Okubayashi, K.Hisada, T.Hori, 坂部佳祐, 天野忠昭, 雨森則人]
通讯作者:
雨森則人
Movement of Solder Fillers due to Unevenness of Interfacial Tension in Self-Organization Assembly Process
自组织组装过程中界面张力不均匀导致焊料移动
DOI:
--
发表时间:
2008
期刊:
影响因子:
--
作者:
[K. Ohta, K. Yasuda, K. Fujimoto]
通讯作者:
K. Fujimoto
Solder Filler Motion Driven by Interfacial Tension in Self-Organization Assembly Process
自组织组装过程中界面张力驱动的焊料填充运动
DOI:
--
发表时间:
2009
期刊:
J.Solid Mechanics and Materials Engineering 3,12
影响因子:
--
作者:
[T.Baba, K.Hirogaki, I.Tabata, S.Okubayashi, K.Hisada, T.Hori, 坂部佳祐, 天野忠昭, 雨森則人, 八重真治, 堀照夫, 天野忠昭, 堀照夫, 八重真治, 安田清和]
通讯作者:
安田清和
Micro Bump Formation by Self-Replication Method
通过自我复制方法形成微凸块
DOI:
--
发表时间:
2010
期刊:
影响因子:
--
作者:
[T. Hori, M. Belmas, K. Hisada, I. Tabata, 安田清和]
通讯作者:
安田清和
Observation of Solder Fillers Coalescence in Resin for Development of Self-Organization Assembly Process
观察树脂中焊料填料的聚结,以开发自组织组装工艺
DOI:
--
发表时间:
2008
期刊:
e-Proceedings of the 33rd International Electronics Manufacturing Technology Conference No.C5.1
影响因子:
--
作者:
[K. Ohta, M. Toya, K. Yasuda, M. Matsushima, K. Fujimoto]
通讯作者:
K. Fujimoto
共 21 条
Evaluation of Wettability for Microelectronics Materials Based on Dynamic Wetting Model
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批准号:11650744
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项目类别:Grant-in-Aid for Scientific Research (C)
-
资助金额:$2.3万
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财政年份:1999
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负责人:YASUDA Kiyokazu
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依托单位:
Microfabrication and Joining by Field Evaporation Mechanism
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批准号:03805063
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项目类别:Grant-in-Aid for General Scientific Research (C)
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资助金额:$1.09万
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财政年份:1991
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负责人:YASUDA Kiyokazu
-
依托单位:
海外基金