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Investigation of ductile-to-brittle transitions on ultra-precision machining of single crystal silicon

单晶硅超精密加工中的韧脆转变研究

基本信息

批准号：
11650753
负责人：
SUMOMOGI Tsunetaka
金额：
$ 1.79万
依托单位：
Hiroshima Kokusai Gakuin University
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
1999
资助国家：
日本
起止时间：
1999 至 2000
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-11650753/
关键词：
nano-scale machining ductile mode machining single crystal silicon ductile-brittle transition surface crack subsurface crack scanning force microscope scanning laser microscope 超微細胞加工ぜい性材料ダイヤモンド工具原子間力顕微法

项目摘要

The studies on nano-scale machining of brittle materials such as silicon and glass, have come into notice in recent years. A material removal with plastic deformation, known as ductile mode machining, has been achieved by a very small depth of cut. When surface cracks occurred with being increased the depth of cut, the machining has been commonly considered to be brittle mode. The workpiece materials used in the present experiment was single crystal silicon with (100) surface. A single crystal Vickers diamond pyramid indentor with an apex angle of 136° was used as the cutting tool. The ultra precision turning machine consists of an aerostatic bearing spindle for workpiece revolution and a roller bearing slide for tool feed. Face-turning of the workpiece was done from the center to the outside with a constant cutting speed between 150 m/min and 1500 m/min and a constant feed rate of 0.03 mm/revolution, and a spiral groves were formed. An inclination was given to the mounted workpiece by a partly inserted spacer between the workpiece and the chuck surface in order to generate various depth of grooves. The ductile-brittle transition points were examined by the observations not only on the surface cracks but also on the subsurface cracks. The scanning force microscope is used for measuring the depth of the grooves and observing the surface cracks. The distance from the surfaces to the deepest point of the subsurface cracks on obliquely sectioned and then etched surfaces are measured by the. The subsurface cracks are generated under the cutting grooves in some case, even if the depth is less than the ductile-brittle transition point based on the surface cracks. It is detected that the ductile-brittle transition point determined by the subsurface cracks is shallower than that determined by the surface cracks. Therefore the evaluation of the subsurface cracks would be important especially in finishing.

硅、玻璃等脆性材料的纳米加工研究近年来引起了人们的注意。一个材料去除与塑性变形，被称为延性模式加工，已实现了一个非常小的切削深度。当表面裂纹随着切削深度的增加而产生时，通常认为切削是脆性的。本实验中所用的工件材料是具有（100）表面的单晶硅。使用具有136°顶角的单晶维氏金刚石棱锥压头作为切削工具。超精密车床由一个用于工件旋转的空气静压轴承主轴和一个用于刀具进给的滚柱轴承滑块组成。以150 m/min和1500 m/min之间的恒定切削速度和0.03 mm/转的恒定进给速率从中心向外完成工件的端面车削，并形成螺旋格罗夫斯。通过在工件和卡盘表面之间部分插入的间隔件使安装的工件倾斜，以产生各种深度的凹槽。通过对表面裂纹和亚表面裂纹的观察，确定了韧脆转变点。利用扫描力显微镜测量了沟槽深度，观察了表面裂纹。在斜切面上，腐蚀后的表面上，从表面到亚表面裂纹最深点的距离是用。在某些情况下，即使深度小于基于表面裂纹的韧脆转变点，也会在切削槽下方产生亚表面裂纹。结果表明，亚表面裂纹所决定的韧脆转变点比表面裂纹所决定的韧脆转变点要浅。因此，亚表面裂纹的评估将是非常重要的，特别是在精加工。