Wireless Integrated Circuits for the Era of 6G: System-in-a-Package

6G时代的无线集成电路：系统级封装

• 批准号: FT230100104
• 负责人: Dr Xi (Forest) Zhu
• 金额: $ 60.11万
• 依托单位: University of Technology Sydney
• 依托单位国家: 澳大利亚
• 项目类别: ARC Future Fellowships
• 财政年份: 2024
• 资助国家: 澳大利亚
• 起止时间: 2024-06-30 至 2028-06-29
• 项目状态: 未结题
• 来源: https://dataportal.arc.gov.au/RGS/Web/Grants/FT230100104
• 关键词: Wireless; Integrated; Circuits; Era; 6G

The aim of this project is to build a hardware foundation for future wireless integrated circuits, using a combination of silicon and compound semiconductor technologies. The project will generate knowledge for circuit design and system integration to pivot towards the engineering of emerging 6G technology. Expected outcomes include a transceiver-in-package using multiple semiconductor technologies and the development of sovereign design capabilities. The results will constitute an important step towards implementing 6G. Benefits for Australia include the development of early career workers, generation of intellectual property, and securing social and economic benefits for Australians through application of this next-generation technology.

该项目的目的是利用硅和化合物半导体技术的结合，为未来的无线集成电路建立硬件基础。该项目将为电路设计和系统集成提供知识，以解决新兴6G技术的工程问题。预期结果包括使用多种半导体技术的封装收发器和自主设计能力的发展。研究结果将是实现6G的重要一步。对澳大利亚的好处包括早期职业工人的发展，知识产权的产生，以及通过下一代技术的应用为澳大利亚人确保社会和经济效益。