Development ofPb-free SolderAlloys Using the Melting Temperature Estimation Method for Sn Alloys

使用锡合金熔化温度估算方法开发无铅焊料合金

基本信息

  • 批准号:
    12650726
  • 负责人:
  • 金额:
    $ 2.3万
  • 依托单位:
  • 依托单位国家:
    日本
  • 项目类别:
    Grant-in-Aid for Scientific Research (C)
  • 财政年份:
    2000
  • 资助国家:
    日本
  • 起止时间:
    2000 至 2001
  • 项目状态:
    已结题

项目摘要

Sn-Pb alloys are used currently as a solder in electrical and electronic industries. In recent years, however, it has been claimed that there is a possibility of polluting the environment with toxic Pb contained in the solder. Much attention has been paid to the development of Pb-free solder alloys in various countries. In this study, it was aimed to develop some Pb-free solder alloys utilizing an interesting relation between the melting temperature and the alloy composition which was discovered by present investigator.In the first year, 17-types Sn-based alloys containing Ag, Bi, Zn and In were designed as the first step candidate alloys. All of them were designed so as to have the same melting temperature as that of Sn-Pb solder, 456K. Measured melting temperatures of these alloys were within the range of 453-466K, and this results supported the usefulness of the melting temperature estimation method.In the second year, some fundamental experiments were made in order to obtain inform … More ation which is necessary for the design of second step candidate alloys. The effect of alloying elements, Zn, Ag, Cd, In, Sb, Pb and Bi on the hardness, electrical resistivity, lattice constant and wettability of Sn based alloy was measured. It was shown that the addition of all alloying elements increased the hardness and resistivity of Sn alloys. Among these elements, Bi has the largest hardening effect due to the large distortion of Sn crystal lattice. The addition of Pb, Ag, Bi was found to improve the wettability of Sn alloys with copper plate. By using obtained semi-quantitative information, 6-types of Sn-Zn and Sn-Bi based alloys containing Ag and In were designed. It was found that Sn-Zn based sencond candidate alloys had similar mechanical properties to those of Sn-3.5Ag-0.7Bi, the most promising alloy as Pb-free solder for the next generation. Also, Sn-Bi based candidate alloys had equal wet-ability with Cu plate. Based on these experiments, it was demonstrated that Pb-free solder alloys could be developed efficiently by employing the present melting temperature estimation method. Less
锡铅合金目前在电气和电子工业中用作焊料。然而,近年来,有人声称,焊料中含有有毒的铅,有可能污染环境。无铅焊料合金的发展受到各国的高度重视。本研究旨在利用目前研究人员发现的熔化温度与合金成分之间的有趣关系来开发一些无铅焊料合金。第一年,设计了17种含银、铋、锌和铟的锡基合金作为第一步候选合金。所有这些焊料的熔化温度都与锡铅焊料的熔化温度456K相同。这些合金的熔化温度在453-466K范围内,这一结果支持了熔化温度估计方法的有效性。第二年,为了获得信息,进行了一些基础性的实验,以获得…的信息这对于第二步候选合金的设计是必要的。研究了合金元素锌、银、镉、铟、锑、铅、铋对锡基合金硬度、电阻率、晶格常数和润湿性的影响。结果表明,所有合金元素的加入都提高了锡合金的硬度和电阻率。在这些元素中,由于锡的晶格变形较大,因此铋的硬化效果最大。铅、银、铋的加入改善了锡合金与铜板的润湿性。利用所获得的半定量信息,设计了6种含Ag和In的锡-锌和锡-铋基合金。结果表明,锡锌基二次候选合金的力学性能与最有希望成为下一代无铅焊料的锡-3.5Ag-0.7Bi合金相似。此外,锡铋基候选合金的润湿性与铜板相当。实验结果表明,采用现有的熔化温度估算方法可以有效地开发无铅焊料合金。较少

项目成果

期刊论文数量(6)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
H. Ezaki: "Estimation of Liquiclus Temperature of Sn Based Alloys and Its ; Application to the Design of Pb-Free Solder"Journal of Materials Science and Engineering : Materials in Electronics. Vol.13 No.5. 269-272 (2002)
H. Ezaki:“锡基合金及其液体温度的估算;在无铅焊料设计中的应用”材料科学与工程杂志:电子材料。
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    0
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H. Ezaki: "Application of Melting Temperature Estimation Method for Sn Alloys to the Design of Pb-Free Solder"Proceedings of the Meeting on Micro-Soldering, Japan Welding Society. No.31. 29-36 (2001)
H. Ezaki:“锡合金熔化温度估算方法在无铅焊料设计中的应用”日本焊接学会微焊接会议论文集。
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H.Ezaki: "Estimation of Liquidus Temperature of Sn Based Alloys and Its Application to the Design of Pb-Free Solder"Journal of Materials Science and Engineering : Electronic Materials. (印刷中). (2002)
H.Ezaki:“锡基合金液相线温度的估算及其在无铅焊料设计中的应用”材料科学与工程杂志:电子材料(2002 年出版)。
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    0
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江崎尚和: "スズ合金の融点予測と鉛フリーはんだの設計への応用"第31回溶接学会マイクロ接合研究委員会ソルダリング分科会講演資料. No.31. 29-36 (2001)
Naokazu Ezaki:“锡合金熔点的预测及其在无铅焊料设计中的应用”第31届焊接学会微连接研究委员会焊接小组委员会演示材料第31. 29-36号(2001年)。
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    0
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H.Ezaki: "Estimation of Liquidus Temperature of Sn Based Alloys and Its Application to the Design of Pb-Free Solder"Journal of Materials Science and Engineering : Materials in Electronics. Vol.13 No.5. 269-272 (2002)
H.Ezaki:“锡基合金液相线温度的估算及其在无铅焊料设计中的应用”材料科学与工程杂志:电子材料。
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EZAKI Hisakazu其他文献

EZAKI Hisakazu的其他文献

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{{ truncateString('EZAKI Hisakazu', 18)}}的其他基金

Design of Engineering Education Program Originated in the Regional and Traditional Industry
源于地域传统产业的工程教育课程设计
  • 批准号:
    21500853
  • 财政年份:
    2009
  • 资助金额:
    $ 2.3万
  • 项目类别:
    Grant-in-Aid for Scientific Research (C)
Development of Anisotropic Conductive Film Using Pb-free Solder and Its Application to the Micro-joining of IC-chip
无铅焊料各向异性导电薄膜的研制及其在IC芯片微连接中的应用
  • 批准号:
    14350393
  • 财政年份:
    2002
  • 资助金额:
    $ 2.3万
  • 项目类别:
    Grant-in-Aid for Scientific Research (B)
The role of electronic structures of passive film in corrosion resistance of transition-metal based alloys
钝化膜电子结构在过渡金属基合金耐蚀性中的作用
  • 批准号:
    08650827
  • 财政年份:
    1996
  • 资助金额:
    $ 2.3万
  • 项目类别:
    Grant-in-Aid for Scientific Research (C)

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