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Development of Anisotropic Conductive Film Using Pb-free Solder and Its Application to the Micro-joining of IC-chip

无铅焊料各向异性导电薄膜的研制及其在IC芯片微连接中的应用

基本信息

批准号：
14350393
负责人：
EZAKI Hisakazu
金额：
$ 9.34万
依托单位：
Suzuka National College of Technology
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (B)
财政年份：
2002
资助国家：
日本
起止时间：
2002 至 2004
项目状态：
已结题

项目摘要

The purpose of this study was to develop a quite new and unique anisotropic conductive film using Pb free solder which is necessary for a new micro-joining technology This anisotropic conductive film could be applicable to the IC chip with the electrode pitch less than 20〜30 micron. Besides, there is no restriction of the shape and arrangement of electrodes. Except for the development of anisotropic conductive film, fundamental information necessary for the design and development of Pb free solder was also obtained experimentally and theoretically.As the results, the technology for making the insulation film (polyimide film) which has fine and line up holes with a diameter of 10 micron was established by utilizing photolithography technique. In addition, it was demonstrated that the combination of this technique and the electroplating technique could make the process easy to fill solder particles up into fine holes on the insulation film. The optimum conditions for the electro-deposition (current density and time) of Sn-Pb and Pb free solders were determined in this study. By using the anisotropic conductive film developed in this study, the joining of electrodes on flexible printed board was tried by utilizing the bonding machine for practical IC chip micro-joining. It was confirmed that the good joining could be attained, and the possibility for the practical use of developed anisotropic conductive film. Moreover, a different type anisotropic conduction film contains solder particles dispersed in thermosetting resin was proposed, and the usefulness of it was shown by the practical bonding of the electrode on flexible printed board. Also in this study, the accumulation of information on melting temperature, strength, conductivity, wettability and phase stability of Sn alloys at extremely low temperature were carried out experimentally for the further design of new Pb-free solder alloys necessary for the new anisotropic conductive film.

本研究的目的是利用一种新的微连接工艺所需的无铅焊料来研制一种全新的、独特的各向异性导电膜，这种各向异性导电膜可以适用于电极间距小于20~30微米的IC芯片。此外，电极的形状和排列不受限制。除了开发各向异性导电膜外，还从实验和理论上获得了设计和开发无铅焊料所需的基本信息。作为结果，建立了利用光刻技术制备直径为10微米的细小排列孔洞的绝缘膜(聚酰亚胺薄膜)的工艺。此外，将该技术与电镀技术相结合，可以使该工艺易于将焊料颗粒填充到绝缘膜的细小孔洞中。确定了电沉积锡铅焊料和无铅焊料的最佳工艺条件(电流密度和时间)。利用研制的各向异性导电膜，利用键合机对柔性印制板上的电极进行了焊接试验，实现了实际的IC芯片微连接。结果表明，所研制的各向异性导电膜具有良好的接合性能，具有实际应用的可能性。此外，还提出了一种不同类型的各向异性导电膜，该导电膜含有分散在热固性树脂中的焊料颗粒，并通过该电极在柔性印制板上的实际粘接显示了其实用性。在本研究中，还对锡合金在极低温度下的熔化温度、强度、电导率、润湿性和相稳定性进行了实验积累，为进一步设计新的各向异性导电膜所需的新型无铅焊料合金奠定了基础。