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High Speed Slicing by Thin Diamond Wire Tool

使用细金刚石线工具进行高速切片

基本信息

批准号：
13650139
负责人：
SUWABE Hitoshi
金额：
$ 2.24万
依托单位：
Kanazawa Institute of Technology
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
2001
资助国家：
日本
起止时间：
2001 至 2003
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-13650139/
关键词：
Slicing Wire Tool Diamond Grains Thin Wire Tool Hard and Brittle Materials 研削切断半導体材料

项目摘要

As the results until last year, the plating apparatus to make thin diamond wire tool under φ180μm and the slicer to run the wire tool at high speed were manufactured for experiment of this research project. And, the relation between twist pitch of the thin wire tool and the processing characteristics were clear. In this year, the processing mechanisms of thin wire tool are examined through the material intensity test and the slicing test of thin wire tool. And, the followings are clear.1.As the results to examine the best plating conditions to thin wire tool from point of the plating time, the plating pool length, the current density, the pre-plating pool length to improve stick strength between diamond grains and core wire is 200mm, the plating pool length to fix the diamond grains is 200mm, the after-plating pool length to make uniform extrusion amount is 200mm, and the current density is 1.5〜2.0×10^3 A/m^2.2.As the results of the intensity test of thin wire tool, the tensile strength of wire tool decreases to the normal diamond wire tool by effect of decrease of the cross section. And, the twist strength of thin wire tool shows the value of 1.5 times to the normal wire tool.3.As the examinations of effect between twist pitch of thin wire tool and slicing characteristics, the slicing efficiency shows the best value at 8mm of twist pitch. It is clear that the many diamond grains act on the processing surface in case of thin wire tool of long pitch.4.As the results of measurement for processing surface, the accuracy of processing surface by the thin wire tool shows same value with the accuracy by the normal wire tool.

根据去年的研究成果，研制了φ 180 μ m以下金刚石细丝工具的镀制装置和高速运行金刚石细丝工具的切片机，用于本研究项目的实验。并明确了细丝刀具的螺距与加工特性之间的关系。本年度通过材料强度试验和细丝刀具切片试验，对细丝刀具的加工机理进行了检验。1.从电镀时间、电镀池长度、电流密度三个方面考察了细丝工具的最佳电镀条件，为提高金刚石颗粒与芯线的结合强度，预镀池长度为200mm，固定金刚石颗粒的电镀池长度为200mm，使挤压量均匀的后镀池长度为200mm，电流密度为1.5 × 2.0 × 10^3A/m^2。2.通过对细丝工具的强度测试，由于截面减小的影响，金刚石工具的抗拉强度降低到普通金刚石工具的水平。3.通过对细丝刀具扭距对切片性能影响的研究，发现扭距为8mm时切片效率最高。4.对加工表面的测量结果表明，用细丝刀具加工的表面精度与用普通钢丝刀具加工的表面精度相当。