Formation of Photocatalytic Surface with electroless Plated Nickel/TiO_2 Composite films

化学镀镍/TiO_2复合膜光催化表面的形成

• 批准号: 13650784
• 负责人: MATSUDA Hitoshi
• 金额: $ 0.64万
• 依托单位: HIMEJI INSTITUTE OF TECHNOLOGY
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 2001
• 资助国家: 日本
• 起止时间: 2001 至 2003
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-13650784/
• 关键词: Electroless Plating; Composite Plating; Composite film; Semiconductor; Titanium Dioxide; Fine Particle; Photocurrent; Photocatalyst; 光電気化学特性; 無電解ニッケルめっき; 超微粒子; 半導体複合薄膜; 共析機構; 光電気化学; 自己触媒めっき; ニッケル

Electroless Plated Ni-P/TiO_2 composite films were deposited from an acidic solution or an alkaline solution containing photocatalytic TiO_2 particles (P-25). The dispersion of particles in the films was investigated by the cross-sectional observation with a transmission electron microscope. The particle content in the films increased with an increase of its amount in the solutions. The deposition rate of composite films was independent of the amount of TiO_2 particles in the solutions(0 〜 100 g dm^<-3>). Photocurrent density of the films in 0.1 M NaOH aqueous solution rose with particle content in the films.

在酸性溶液和含有光催化二氧化钛颗粒(P-25)的碱性溶液中制备了化学镀Ni-P/TiO2光化学复合膜。通过透射电子显微镜的横截面观察，研究了颗粒在薄膜中的分散情况。薄膜中的颗粒含量随着溶液中颗粒含量的增加而增加。复合膜的沉积速率与溶液中二氧化钛颗粒的含量(0~100gdm^&lt；-3&gt；)无关。薄膜在0.1M氢氧化钠水溶液中的光电流密度随薄膜中颗粒含量的增加而增大。

项目成果

福室直樹, 臼井勇樹, 小松聖季, 八重真治, 松田 均: "無電解Ni-P/TiO_2複合めっき膜の構造と光電流密度"表面技術. 55巻4号(印刷中). (2004)

Naoki Fukumuro、Yuki Usui、Seiki Komatsu、Shinji Yae、Hitoshi Matsuda：“化学镀 Ni-P/TiO_2 复合镀膜的结构和光电流密度”，第 55 卷，第 4 期（出版中）。