Development of progressive micro-molding system using photosensitive resin

在电子、信息和生物技术设备中，微米级的小部件是必不可少的。注射成型可以批量生产小零件，但注射模具通常结构复杂，无法制造微米以下形状的小零件。因此，人们越来越多地寻求发展新的制造技术，以大规模生产小零件。有研究使用印刷或模塑技术调查微米以下图案的电子元件。在本研究中，我们开发了两种成型装置，并展示了具有二维和三维形状的小零件的成型。例如，点阵形、杯形、高向柱形和蘑菇形。研究了光敏树脂在成型过程中的收缩效应。

Small parts in the order of micrometer are indispensable to electronic, information and biotechnology devices. Injection moulding enables mass production of small parts, however injection moulds usually have complicated structures, disabling the manufacture of small parts with shapes below the micrometer scale. The development of new manufacturing techniques is thus increasingly sought for the mass production of small parts. There are studies which investigated electronic elements with patterns below micrometer using printing or moulding techniques. In this study, we developed two kinds of moulding apparatus and showed the moulded small parts with 2 and 3 dimensions shapes. For example, lattice shape, cup shape, high aspect column shape and mushroom shape. And we study the shrinkage effects of photosensitive resin during the proposed moulding process.