Development of progressive micro-molding system using photosensitive resin

在电子、信息和生物技术设备中，微米量级的小零件是不可或缺的。注塑成型可以大量生产小零件，但注塑模具通常具有复杂的结构，无法制造形状小于微米的小零件。因此，人们越来越多地寻求开发新的制造技术，以实现小部件的大规模生产。有一些研究使用印刷或模压技术来研究图案在微米以下的电子元件。在这项研究中，我们开发了两种成型装置，并显示了成型的小零件的二维和三维形状。例如，格子形状、杯状、高纵横比柱状和蘑菇状。并研究了光敏树脂在所提成型过程中的收缩效应。

Small parts in the order of micrometer are indispensable to electronic, information and biotechnology devices. Injection moulding enables mass production of small parts, however injection moulds usually have complicated structures, disabling the manufacture of small parts with shapes below the micrometer scale. The development of new manufacturing techniques is thus increasingly sought for the mass production of small parts. There are studies which investigated electronic elements with patterns below micrometer using printing or moulding techniques. In this study, we developed two kinds of moulding apparatus and showed the moulded small parts with 2 and 3 dimensions shapes. For example, lattice shape, cup shape, high aspect column shape and mushroom shape. And we study the shrinkage effects of photosensitive resin during the proposed moulding process.