Development of double side surface ultra-smoothness polishing technique by means of gearless workpiece rotation method based on new concept

基于新理念的无齿轮工件旋转法双面超光滑抛光技术的开发

• 批准号: 17360065
• 负责人: YASUI Heiji
• 金额: $ 9.79万
• 依托单位: Kumamoto University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B)
• 财政年份: 2005
• 资助国家: 日本
• 起止时间: 2005 至 2006
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-17360065/
• 关键词: double surface polishing; high removal rate; ultra-high pressure; ultra-high speed; new method; gearless workpiece rotation; polisher; magnetic disk substrate

Using ultra-high polishing pressure and polishing speed, this research aims to develop the double side surface polishing method of ultra-high removal rate for various kinds of workpieces such as magnet disk substrate, silicon wafer and so on. The new type of double side surface polishing machine based on new concept is manufactured on trial. In the machine, the workpiece is rotated by the couple of the friction forces in the reverse directions to each other, which are caused from the contact between workpiece and upper or lower polishing plate. That is, in the rotation mechanism of workpiece, the gear is not used. On the contrary, in the conventional polishing machine, the rotation of workpiece is done with the gear cut on the outside circle of carrier holding the disk substrate. Furthermore the double side surface polishing characteristics in the conditions of ultra-high polishing pressure and polishing speed using the new type of machine is examined. The summary is as follows ;1) Imp … More rovement of polishing machine(1) Establishment of stable rotation technique of workpieceFirst of all, the couple of friction forces is caused by stepping the polishing plate. In the method, to machine the plate the precise seep is difficult. And also the stable rotation of workpiece is obtained difficult. To resolve the problem, the new technique in which the contact friction force between the workpiece and polisher is changed by holing a part of the polisher (surface is developed. Using the method, the stable rotation of workpiece is done.(2) Development of cooling system of polisherIn the polishing conditions of ultra-high pressure and speed, large polishing heat occurs. Due to the heat, polisher surface is damaged. To solve the problem, the cooling systems of polishing plate are developed. The method is useful for the remove of generated heat.(3) Investigation of dynamic pressure on polishing characteristicsIn the condition ultra-high polishing speed, large buoyancy is found to reduce polishing pressure. On the basis of the result, the relationship between removal rate and polishing condition is cleared experimentally.2) Development of linear type of double surface polishing machineA linear type of double surface polishing machine in which the workpiece is rotated by the couple of friction forces as mentioned above for the rotary type of new double surface polishing machine is manufactured on trial. The machine is ascertained possible to perform the effective polishing operation.3) Investigation of polishing characteristics using the new type of double side surface polishing machineTo clear the polishing characteristics using the new type of polishing machine, the experiment is carried out by the various kinds of polishing conditions. The influence of polishing conditions on the removal rate and smoothness is cleared experimentally. Less

本研究旨在利用超高抛光压力和抛光速度，开发磁盘基片、硅片等多种工件的超高去除率双面抛光方法，试制基于新概念的新型双面抛光机。在机器中，工件在工件与上抛光板或下抛光板接触产生的相互相反方向的摩擦力的作用下旋转。也就是说，在工件的旋转机构中，不使用齿轮。相反，在传统的抛光机中，工件的旋转是通过在保持盘基板的载体的外圆上切割齿轮来完成的。并对新型抛光机在超高抛光压力和超高抛光速度条件下的双面抛光特性进行了研究。总结如下：1）Imp ...更多信息 抛光机的改进（1）工件稳定旋转技术的建立首先，抛光板的步进运动产生摩擦力偶。在该方法中，要加工出精确的渗液是一个难点。而且工件的稳定旋转也很难获得。为了解决这一问题，开发了一种新技术，即通过在抛光机的一部分（表面）上开孔来改变工件与抛光机之间的接触摩擦力。利用该方法实现了工件的稳定旋转。(2)抛光机冷却系统的研制在超高压、超高速的抛光条件下，会产生大量的抛光热。由于高温，抛光机表面受损。为解决这一问题，研制了抛光板冷却系统。该方法可用于去除产生的热量。(3)动压力对抛光特性的影响研究在超高抛光速度下，大浮力可以降低抛光压力。在此基础上，通过实验研究，明确了去除率与抛光条件的关系。2）直线型双面抛光机的研制试制了一台直线型双面抛光机，该抛光机中工件通过上述新型旋转式双面抛光机的摩擦力对旋转。3）新型双面抛光机的抛光特性研究为了明确新型抛光机的抛光特性，在各种抛光条件下进行了实验研究。实验研究了抛光条件对去除率和光滑度的影响。少

项目成果

Possibility of Ultra-Ultra High Pressure Polishing of Magnetic Disk Substrate

磁盘基板超超高压抛光的可能性

• 发表时间: 2006
• 期刊: Proc. 6th International Conference and 10th annual general meeting of the european society for precision engineering and nanotechnology
• 作者: Heiji YASUI;Kanta YAMAGUCHI;Takuya NIKI
• 通讯作者: Takuya NIKI

アルミ磁気ディスク基板の超高圧力・超高速度ポリシングにおけるポリシャ寿命の検討(第1報)- -層ナップ構造ポリシャの場合 -

铝磁盘基板超高压超高速抛光中抛光机寿命的检验（第一篇报告） - - 层状毛刺结构抛光机案例 -

• 发表时间: 2007
• 期刊: 精密工学会誌 Vol. 73・No. 1
• 作者: 安井平司;山口寛太;松川誠治;山崎穣
• 通讯作者: 山崎穣

Polisher Life in Ultra-High Pressure and Ultra-High Speed Polishing of NiP Plated Aluminum Magnetic Disk Substrate

镀NiP铝磁盘基板超高压超高速抛光的抛光机寿命

• 发表时间: 2005
• 期刊: Proc. ASPE 20th Annual Meeting
• 作者: Heiji YASUI;Yutaka YAMASAKI;Kanta YAMAGUCHI;Seiji MATSUKAWA;Shoji KURIBAYASHI;Takuya NIKI
• 通讯作者: Takuya NIKI

Investigation on Polisher Life in Ultra-high Pressure and Speed Polishing of Aluminum Type of Magnetic Disk Substrate ( 1^<st> Report )-In Case of Single Nap Layer Type of Polisher-

铝型磁盘基板超高压高速抛光中抛光机寿命的研究（1^<st>报告）-以单绒毛层型抛光机为例-

• 发表时间: 2007
• 期刊: Journal of the Japan Society for Precision Engineering Vol.73, No. 1
• 作者: Heiji YASUI;Kanta YAMAGUCHI;Seiji MATSUKAWA;Yutaka YAMASAKI
• 通讯作者: Yutaka YAMASAKI

Polisher Life in Ultra-smoothness Polishing of Magnetic Disk Substrate Using New Double Side Surface Polishing Machine

使用新型双面抛光机对磁盘基板进行超光滑抛光时的抛光机寿命

• 发表时间: 2006
• 期刊: Proc. ASPE 21 Annual Meeting
• 作者: Heiji YASUI;Kanta YAMAGUCHI;Takuya NIKI;Shingo OTSUKA;Tomohiko NAGATA;Hisaaki KUBOTA
• 通讯作者: Hisaaki KUBOTA