Development of double side surface ultra-smoothness polishing technique by means of gearless workpiece rotation method based on new concept

基于新理念的无齿轮工件旋转法双面超光滑抛光技术的开发

• 批准号: 17360065
• 负责人: YASUI Heiji
• 金额: $ 9.79万
• 依托单位: Kumamoto University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B)
• 财政年份: 2005
• 资助国家: 日本
• 起止时间: 2005 至 2006
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-17360065/
• 关键词: double surface polishing; high removal rate; ultra-high pressure; ultra-high speed; new method; gearless workpiece rotation; polisher; magnetic disk substrate

Using ultra-high polishing pressure and polishing speed, this research aims to develop the double side surface polishing method of ultra-high removal rate for various kinds of workpieces such as magnet disk substrate, silicon wafer and so on. The new type of double side surface polishing machine based on new concept is manufactured on trial. In the machine, the workpiece is rotated by the couple of the friction forces in the reverse directions to each other, which are caused from the contact between workpiece and upper or lower polishing plate. That is, in the rotation mechanism of workpiece, the gear is not used. On the contrary, in the conventional polishing machine, the rotation of workpiece is done with the gear cut on the outside circle of carrier holding the disk substrate. Furthermore the double side surface polishing characteristics in the conditions of ultra-high polishing pressure and polishing speed using the new type of machine is examined. The summary is as follows ;1) Imp … More rovement of polishing machine(1) Establishment of stable rotation technique of workpieceFirst of all, the couple of friction forces is caused by stepping the polishing plate. In the method, to machine the plate the precise seep is difficult. And also the stable rotation of workpiece is obtained difficult. To resolve the problem, the new technique in which the contact friction force between the workpiece and polisher is changed by holing a part of the polisher (surface is developed. Using the method, the stable rotation of workpiece is done.(2) Development of cooling system of polisherIn the polishing conditions of ultra-high pressure and speed, large polishing heat occurs. Due to the heat, polisher surface is damaged. To solve the problem, the cooling systems of polishing plate are developed. The method is useful for the remove of generated heat.(3) Investigation of dynamic pressure on polishing characteristicsIn the condition ultra-high polishing speed, large buoyancy is found to reduce polishing pressure. On the basis of the result, the relationship between removal rate and polishing condition is cleared experimentally.2) Development of linear type of double surface polishing machineA linear type of double surface polishing machine in which the workpiece is rotated by the couple of friction forces as mentioned above for the rotary type of new double surface polishing machine is manufactured on trial. The machine is ascertained possible to perform the effective polishing operation.3) Investigation of polishing characteristics using the new type of double side surface polishing machineTo clear the polishing characteristics using the new type of polishing machine, the experiment is carried out by the various kinds of polishing conditions. The influence of polishing conditions on the removal rate and smoothness is cleared experimentally. Less

本研究旨在利用超高抛光压力和抛光速度，开发针对磁盘基板、硅片等各类工件的超高去除率的双面抛光方法。基于新理念的新型双面抛光机试制。在该机器中，工件通过彼此相反方向的摩擦力耦合而旋转，该摩擦力是由工件与上抛光板或下抛光板之间的接触引起的。即，在工件的旋转机构中，不使用齿轮。相反，在传统的抛光机中，工件的旋转是通过在固定盘基片的载体的外圆上切削的齿轮来完成的。此外，还考察了新型机器在超高抛光压力和抛光速度条件下的双面抛光特性。总结如下：1）抛光机旋转改进（1）工件稳定旋转技术的建立首先，抛光盘的步进产生摩擦力偶。该方法中，对板材进行精确渗漏加工是困难的。而且工件的稳定旋转也很难获得。为了解决这个问题，开发了通过在抛光机(表面)的一部分上开孔来改变工件和抛光机之间的接触摩擦力的新技术。利用该方法，实现了工件的稳定旋转。(2)抛光机冷却系统的开发在超高压和超高速的抛光条件下，产生大量的抛光热量。由于热量，抛光机表面被损坏。为了解决这个问题，开发了抛光板冷却系统。 该方法对于消除产生的热量很有用。(3)动态压力对抛光特性的研究在超高抛光速度的情况下，发现大的浮力可以降低抛光压力。在此结果的基础上，通过实验明确了去除率与抛光条件之间的关系。2）直线型双面抛光机的开发直线型双面抛光机，其中工件通过如上所述的摩擦力偶而旋转。 新型旋转式双面抛光机试制。确定该机器可以执行有效的抛光操作。3）使用新型双面抛光机的抛光特性研究为了明确使用新型抛光机的抛光特性，在各种抛光条件下进行了实验。通过实验明确了抛光条件对去除率和光滑度的影响。较少的

项目成果

Possibility of Ultra-Ultra High Pressure Polishing of Magnetic Disk Substrate

磁盘基板超超高压抛光的可能性

• 发表时间: 2006
• 期刊: Proc. 6th International Conference and 10th annual general meeting of the european society for precision engineering and nanotechnology
• 作者: Heiji YASUI;Kanta YAMAGUCHI;Takuya NIKI
• 通讯作者: Takuya NIKI

アルミ磁気ディスク基板の超高圧力・超高速度ポリシングにおけるポリシャ寿命の検討(第1報)- -層ナップ構造ポリシャの場合 -

铝磁盘基板超高压超高速抛光中抛光机寿命的检验（第一篇报告） - - 层状毛刺结构抛光机案例 -

• 发表时间: 2007
• 期刊: 精密工学会誌 Vol. 73・No. 1
• 作者: 安井平司;山口寛太;松川誠治;山崎穣
• 通讯作者: 山崎穣

Polisher Life in Ultra-High Pressure and Ultra-High Speed Polishing of NiP Plated Aluminum Magnetic Disk Substrate

镀NiP铝磁盘基板超高压超高速抛光的抛光机寿命

• 发表时间: 2005
• 期刊: Proc. ASPE 20th Annual Meeting
• 作者: Heiji YASUI;Yutaka YAMASAKI;Kanta YAMAGUCHI;Seiji MATSUKAWA;Shoji KURIBAYASHI;Takuya NIKI
• 通讯作者: Takuya NIKI

Investigation on Polisher Life in Ultra-high Pressure and Speed Polishing of Aluminum Type of Magnetic Disk Substrate ( 1^<st> Report )-In Case of Single Nap Layer Type of Polisher-

铝型磁盘基板超高压高速抛光中抛光机寿命的研究（1^<st>报告）-以单绒毛层型抛光机为例-

• 发表时间: 2007
• 期刊: Journal of the Japan Society for Precision Engineering Vol.73, No. 1
• 作者: Heiji YASUI;Kanta YAMAGUCHI;Seiji MATSUKAWA;Yutaka YAMASAKI
• 通讯作者: Yutaka YAMASAKI

Polisher Life in Ultra-smoothness Polishing of Magnetic Disk Substrate Using New Double Side Surface Polishing Machine

使用新型双面抛光机对磁盘基板进行超光滑抛光时的抛光机寿命

• 发表时间: 2006
• 期刊: Proc. ASPE 21 Annual Meeting
• 作者: Heiji YASUI;Kanta YAMAGUCHI;Takuya NIKI;Shingo OTSUKA;Tomohiko NAGATA;Hisaaki KUBOTA
• 通讯作者: Hisaaki KUBOTA