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Development of die-embedded micro sensing system for sensing and control system in precise metal forming processes

开发用于精密金属成型过程中传感和控制系统的模具嵌入式微传感系统

基本信息

批准号：
17360357
负责人：
YANG Ming
金额：
$ 8.28万
依托单位：
Tokyo Metropolitan University
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (B)
财政年份：
2005
资助国家：
日本
起止时间：
2005 至 2007
项目状态：
已结题

项目摘要

A die-embedded sensing system was developed. A prototype of micro sensor chip was fabricated by using photolithography technique. The micro sensor chip with dimensions of 3.4 mm×4.6mm was fabricated. Four sensor units are allocated in the chip with certain distances in circumferential direction, and each sensor unit consists of four strain gauges with dimensions of 0.3mm in length and of 0.1mm in width which are connected as a Whitestone bridge. The sensor chip was embedded near the contact surface with the location at the concentric circle with the contact surface of die. All of the sensor units are connected to a flexible cable, which was extended to out of the die. The sensor chip was completely included in the die, and could be connected to an amplification circuit with antenna so that the user could obtain the information without setting up any additional sensors to the bending machine. As a case study, we applied the die-embedded sensing system to V-bending process. Micro sensor was designed and fabricated for measurement of the load and the bending angle during the processing. The results show that new sensing system has its advantage in comparison with the conventional sensors. The die-embedded sensing system could be a new sensing technique to measure complicated phenomena by monitoring stresses/strains in the die during the process of sheet metal forming.

研制了一种芯片嵌入式传感系统。利用光刻技术制作了微传感器芯片原型。制作了尺寸为3.4mm ×4.6mm的微传感器芯片。在芯片内沿圆周方向间隔一定距离布置4个传感器单元，每个传感器单元由4个长0.3mm、宽0.1mm的应变片组成，应变片之间连接成白石桥。传感器芯片被嵌入在接触表面附近，位置与芯片的接触表面同心圆。所有的传感器单元都连接到一个柔性电缆，该电缆延伸到模具外。传感器芯片完全包含在模具中，并且可以连接到具有天线的放大电路，使得用户可以获得信息，而无需在折弯机上设置任何额外的传感器。作为一个案例研究，我们将芯片嵌入式传感系统应用于V形弯曲工艺。设计并制作了微传感器，用于测量加工过程中的载荷和弯曲角度。结果表明，新的传感系统与传统的传感器相比有其优越性。模具嵌入式传感系统是一种新的传感技术，可以通过监测金属板料成形过程中模具中的应力/应变来测量复杂的现象。