Integrated Cooling Enhancement Technology for Power Electronics

电力电子集成冷却增强技术

• 批准号: LP150100153
• 负责人: Prof Nam-Trung Nguyen
• 金额: $ 25.05万
• 依托单位: Griffith University
• 依托单位国家: 澳大利亚
• 项目类别: Linkage Projects
• 财政年份: 2016
• 资助国家: 澳大利亚
• 起止时间: 2016-02-12 至 2019-10-31
• 项目状态: 已结题
• 来源: https://dataportal.arc.gov.au/RGS/Web/Grants/LP150100153
• 关键词: Integrated; Cooling; Enhancement; Technology; Power

This project aims to develop an unprecedented integrated cooling enhancement technology (IceTech) for silicon carbide on silicon power electronics. IceTech represents a radical departure from current failure-prone packaging solutions. The project aims to elucidate the fundamental interactions between magnetism, heat and mass transfer and apply them to cooling. In partnership with SPTS Technologies, the project then aims to develop fabrication processes for integrating microchannels and highly sensitive integrated silicon carbide temperature sensors into a chip. This novel fabrication technology allows for the implementation of the revolutionary enhanced cooling concept using two-phase flow with magnetic liquid plugs.

该项目旨在为硅电气电子产品开发一种前所未有的集成冷却增强技术（ICETECH）。 Icetech代表了与当前容易失败的包装解决方案的根本性不同。该项目旨在阐明磁性，热量和传质之间的基本相互作用，并将其应用于冷却。随后，该项目与SPTS技术合作，旨在开发用于将微通道和高度敏感的集成硅温度传感器整合到芯片中的制造过程。这种新颖的制造技术允许使用带有磁性液体插头的两相流量来实施​​革命性增强的冷却概念。