Integrated Cooling Enhancement Technology for Power Electronics

电力电子集成冷却增强技术

• 批准号: LP150100153
• 负责人: Prof Nam-Trung Nguyen
• 金额: $ 25.05万
• 依托单位: Griffith University
• 依托单位国家: 澳大利亚
• 项目类别: Linkage Projects
• 财政年份: 2016
• 资助国家: 澳大利亚
• 起止时间: 2016-02-12 至 2019-10-31
• 项目状态: 已结题
• 来源: https://dataportal.arc.gov.au/RGS/Web/Grants/LP150100153
• 关键词: Integrated; Cooling; Enhancement; Technology; Power

This project aims to develop an unprecedented integrated cooling enhancement technology (IceTech) for silicon carbide on silicon power electronics. IceTech represents a radical departure from current failure-prone packaging solutions. The project aims to elucidate the fundamental interactions between magnetism, heat and mass transfer and apply them to cooling. In partnership with SPTS Technologies, the project then aims to develop fabrication processes for integrating microchannels and highly sensitive integrated silicon carbide temperature sensors into a chip. This novel fabrication technology allows for the implementation of the revolutionary enhanced cooling concept using two-phase flow with magnetic liquid plugs.

该项目旨在开发一种前所未有的集成冷却增强技术（IceTech），用于硅功率电子器件上的碳化硅。IceTech代表了对当前容易发生故障的包装解决方案的彻底背离。该项目旨在阐明磁性、热和传质之间的基本相互作用，并将其应用于冷却。该项目与SPTS技术公司合作，旨在开发将微通道和高灵敏度集成碳化硅温度传感器集成到芯片中的制造工艺。这种新颖的制造技术允许使用磁性液体塞的两相流实现革命性的增强冷却概念。