PRECISION MICROPROCESSING OF PERMEABLE HARD BRITTLE MATERIAL BY NANOSECOND- OR CW-LASER AND ITS INTELLECTUALIZATION

纳秒或连续激光对渗透性硬脆材料的精密微加工及其智能化

• 批准号: 19360065
• 负责人: OHMURA Etsuji
• 金额: $ 12.81万
• 依托单位: Osaka University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B)
• 财政年份: 2007
• 资助国家: 日本
• 起止时间: 2007 至 2010
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-19360065/
• 关键词: レーザ加工; 硬脆材料; レーザスクライブ; レーザ内部加工; 吸収係数; 亀裂; 自己集束; 熱伝導解析; 熱応力解析

The precision microprocessing of a hard and brittle materials such as a dielectric or a semiconductor was tried by focusing a permeable nanosecond pulse or CW laser beam in the material surface or the inside. The following matters about elucidation of the processing mechanism and investigation and control of parameters about processing quality were examined from the scientific situation : (1) The measurement of the temperature dependency of the absorption coefficient. (2) Surface or inside processings of permeable materials, and their processing quality assessment. (3) The analysis of a temperature history and a thermal shock phenomenon by the heat transfer analysis and the thermo-elastic-plastic analysis. (4) Fracture mechanics analysis

通过将可穿透的纳秒脉冲或CW激光束聚焦在材料表面或内部，尝试了硬脆材料如电介质或半导体的精密微加工。本文从科学的角度出发，对以下几个方面进行了探讨：（1）吸收系数温度依赖性的测定; (2)透气性材料的表面或内部加工及其加工质量评定。(3)通过传热分析和热弹塑性分析对温度历史和热冲击现象进行分析。(4)断裂力学分析

项目成果

ガラスのレーザスクライブにおける亀裂進展解析

玻璃激光划片中的裂纹扩展分析

• 发表时间: 2009
• 期刊: 日本機械学会論文集, C編 Vol.75, No.759
• 作者: 八幡恵輔;山本幸司;大村悦二
• 通讯作者: 大村悦二

Analysis of Crack Propagation in Stealth Dicing Using Stress Intensity Factor

使用应力强度因子分析隐形切割中的裂纹扩展

• 发表时间: 2009
• 期刊: On-line Proceedings of the 5th International Cong ress on Laser Advanced Materials Processing (LA MP2009)
• 作者: E.Ohmura;K.Ogawa;M.Kumagai;M.Nakano;K.Fukumitsu;H.Morita
• 通讯作者: H.Morita

Modeling of Laser Drilling Considering Multiple Reflection of Laser, Evaporation and Melt Flow

考虑激光多次反射、蒸发和熔体流动的激光钻孔建模

• 发表时间: 2007
• 期刊: Proceedings of the 26th Int. Cong. on Application of Laser and Electro-Optics 2007(ICALEO2007)
• 作者: S. Noguchi;E. Ohmura;W. R. Harp;J. Tu and Y. Hirata
• 通讯作者: J. Tu and Y. Hirata

Laser Processing Mechanism of Monocrystalline Diamond

• 发表时间: 2011
• 作者: Etsuji;Ohmura;Katsuko;Harano;Kenichi;Watatani;Keiji;Ebata

レーザ重ね照射によるガラスのレーザスクライブ亀裂の伸長

重复激光照射导致玻璃中激光划痕裂纹的扩展

• 发表时间: 2008
• 期刊: 精密工学会誌 Vol.74, No.11
• 作者: 山本幸司;羽阪登;森田英毅;大村悦二
• 通讯作者: 大村悦二