PRECISION MICROPROCESSING OF PERMEABLE HARD BRITTLE MATERIAL BY NANOSECOND- OR CW-LASER AND ITS INTELLECTUALIZATION

通过将可穿透的纳秒脉冲或CW激光束聚焦在材料表面或内部，尝试了硬脆材料如电介质或半导体的精密微加工。本文从科学的角度出发，对以下几个方面进行了探讨：（1）吸收系数温度依赖性的测定; (2)透气性材料的表面或内部加工及其加工质量评定。(3)通过传热分析和热弹塑性分析对温度历史和热冲击现象进行分析。(4)断裂力学分析

The precision microprocessing of a hard and brittle materials such as a dielectric or a semiconductor was tried by focusing a permeable nanosecond pulse or CW laser beam in the material surface or the inside. The following matters about elucidation of the processing mechanism and investigation and control of parameters about processing quality were examined from the scientific situation : (1) The measurement of the temperature dependency of the absorption coefficient. (2) Surface or inside processings of permeable materials, and their processing quality assessment. (3) The analysis of a temperature history and a thermal shock phenomenon by the heat transfer analysis and the thermo-elastic-plastic analysis. (4) Fracture mechanics analysis