production and control of a multilayered channel chip for 3-Dimensionl thermal field

三维热场多层通道芯片的制作和控制

• 批准号: 20360061
• 负责人: TSUCHIYA Kensuke
• 金额: $ 12.65万
• 依托单位: The University of Tokyo
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B)
• 财政年份: 2008
• 资助国家: 日本
• 起止时间: 2008 至 2010
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-20360061/
• 关键词: ナノ; マイクロ加工; 温度センサ; 熱制御アクチュエータ; 積層チップ; チャネル; 拡散接合

This research led to the following conclusions :・ We found the optimum bonding conditions for SUS316 in building 3-dimensional micro-reactors with diffusion bonding.・ We compared the thermal performance of micro-reactors made of plastic and metal and showed that the thermal conductivity of the material affects the heat exchange efficiency. We also demonstrated better performance of a diffusion bonded micro-reactor compared to one with a different bonding method.・ We produced a 100 layer micro-reactor with cooling layers. Arranging cooling flow channels in multi-layered micro-reactors can improve heat exchange efficiency.

本研究得出以下结论：·我们找到了SUS316在建立扩散连接三维微反应器时的最佳键合条件。·比较了塑料微反应器和金属微反应器的热性能，发现材料的导热系数对换热效率有影响。我们还展示了扩散键合微反应器与采用不同键合方法的微反应器相比具有更好的性能。·我们生产了一个带有冷却层的100层微反应堆。在多层微反应器中布置冷却流道可以提高换热效率。