Design and packaging of laminated integration chip with cooling channel

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The objectives of this research are to develop piping technology for cooling and sealing technology between layers, and design and package laminated integration chips with cooling channels and sensors.At first we target on to prototype a metal laminated chip. We carried out following preliminary tests for the prototyping.(1)to exam various materials, machining processes, bonding conditions(2)to develop functional elements like sensors and joint connectorsWe evaluated the machining process and welding condition for a material from both of making perspectives such as machinability or bondability and using perspectives such as heat resistance or corrosion resistance. We found it was necessary to select the machining processes according to shape, width and depth of the channels. We found optimal laser power for each thickness of layers. For example, about 50J/mm2 was optimal for bonding 300um stainless sheet on a substrate.Next, we miniaturized the functional elements such as joint connectors for outer pipes and micro thermal couples, and then designed channels and layout of the functional elements to prototype a laminated chip with three layers. We tested the prototype by an exothermic reaction with acid, which is nitration of benzene. The result showed the efficiency of the micro channels, and cooling channels. It also showed that bonding whole surface of the chip is needed to improve heat exchanger effectiveness, and bonding a lot of layers in one process like diffusion bonding is more effective than laser welding.