Proposal of automatic polishing method for die
Proposal of automatic polishing method for die
批准号:
20560102
负责人:
HAGIWARA Shinsaku
金额:
$3.0万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
2008
资助国家:
日本
项目状态:
已结题
起止时间:
2008 至 2010
中文摘要
精密模具制造自动化技术近年来取得了令人瞩目的发展。然而,目前模具的抛光工作仍依赖于人工操作。因此,模具形状变得更加复杂,常规砂轮的应用无法抛光。提出了一种由粘结磨料组成的新型抛光砂轮,并介绍了该砂轮的制造工艺和特点。这种制造的原理和特点不同于传统的砂轮。这里,这种新的抛光轮将被称为MAGIC(磁性智能化合物)。这个轮子有很多优点如下。(1)可以使用转移方法制造适合于各种模具形状的砂轮。(2)利用磁粉和磁场,可以制造出磨粒均匀、分散性好的抛光砂轮。(3)如果车轮被加热溶解,则有可能重塑车轮。(4)所有这些都可以在工厂简单地进行。抛光实验结果表明,抛光性能稳定。
英文摘要
Automatic technology of the precision die manufacturing has accomplished remarkable development recently. However, the polishing work of the die depends still on the manual operation at the present time. As this reason, the die shape became complicated more and the application of conventional grinding wheel is impossible to polish. In this study, a new polishing wheel consisted of bonding abrasive was proposed and the manufacturing technique and characteristics of it were introduced. Principle and features of this manufacturing are different from the conventional grinding wheel. Here this new polishing wheel shall be called MAGIC (MAGnetic Intelligent Compounds). This wheel has many advantages as follows. (1) It is possible to make the wheel which is suitable for various die shapes using the transfer method. (2) By utilizing magnetic particle and magnetic field, the polishing wheel which was excellent in the uniformity and dispersiveness of abrasive grain was able to be manufactured. (3) The wheel reshaping is possible if it is dissolved by the heating. (4) All of them can be simply carried out in the factory. Then it was shown that stabilized polishing characteristics could be expected from the polishing experiment.
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科研奖励(0)
会议论文
形状転写型砥石によるプレス金型材の超音波振動研磨
使用形状传递磨石对冲压模具材料进行超声波振动抛光
DOI:
--
发表时间:
2009
期刊:
日本機械学会山梨講演会講演論文集(山梨大学)
影响因子:
--
作者:
[萩原親作、中村俊博, 他]
通讯作者:
他
弾性砥石による金型研磨
用弹性磨石抛光模具
DOI:
--
发表时间:
2008
期刊:
日本機械学会山梨講演会講演論文集(山梨大学)
影响因子:
--
作者:
[桐原大輔, 倉島優一, 萩原親作]
通讯作者:
萩原親作
Mirror polishing for silicon wafer based on Development of Charcoal tool
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批准号:26420045
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项目类别:Grant-in-Aid for Scientific Research (C)
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资助金额:$3.16万
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财政年份:2014
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负责人:HAGIWARA Shinsaku
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依托单位:
海外基金