Development of scanning nanopipette probe microscope for 0.1 atto little deposition

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We developed a novel volume control technique for local metal-plating deposition using a scanning probe microscope with a nanopipette probe. The nanopipette probe was filled with CuSO_4 electrolyte solution. A Cu dot was electrochemically deposited on an Au surface by applying a dc bias voltage between the electrolyte solution and the surface. The volume of the deposited Cu dot was dependent on the electric charge during the electrochemical reaction. By controlling the electric charge during the deposition, it was possible to control the volume of the Cu dot.