Development of High-speed Transportation Technology of Wafer in Vacuum Process applying the ERG Chuck

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The developed "Electro-rheological gel" has the unique ability to change the surface adhesive property according to an applied electric filed. In this research, the ERG is applied to the chucking device of wafer available for vacuum process and we have aimed at the enhancement of the efficiency in semiconductor process by using the ERG chucking device. The electro-adhesive chuck(EA Chuck) which enables fast-control of the fixing force by an applied voltage is successfully developed and attached to the end-effecter of the wafer transfer robot. From the experimental results of wafer transfer test in vacuum condition, it is clear that the accumulated position error can be extremely suppressed by less-than 0. 1mm at maximum transfer acceleration of 0. 5G.