Sustainable Formation and Application of Thin Copper Alloy Layers by Reduction-Diffusion at Medium-Low Temperatures Using Ionic Liquid Baths

在含Sn2+离子的离子液浴中，在150℃下，化学镀铜层与锡进行阴极电化学合金化，形成多层铜锡金属间化合物。这种技术称为“还原-扩散(RD)”，形成的金属间化合物(Cu6Sn5和Cu3Sn5)与合金化电位有关。在本工作中，我们研究了Cu6Sn5层作为锂离子电池负极的性能。研究了黄铜(铜锌合金)层的形成，发现在合金化过程中，决定层颜色的铜锌相，即Y-Cu5Zn8，13‘-CuZn，和/或a-铜(锌)，与合金化过程中的外加电位有关。

Layers of Cu-Sn intermetallic compounds were formed by cathodic elec-trochemical alloying of electroless Cu layers with Sn using an ionic liqui bath containing Sn2+ ions at 150°C. The technique is called "reduction-diffusion(RD)" and the intermetallics formed(i. e. Cu6Sn5 and Cu3Sn) were dependent on the alloying potential. In the present work, we investigated the perfor-mance of the Cu6Sn5 layer as an anode of Li-ion battery. The formation of brass(Cu-Zn alloy) layers was also examined and it was found that Cu-Zn phases, i. e. y-Cu5Zn8, 13'-CuZn, and/or a-Cu(Zn), which define the color of the layers, were dependent on applied potential during the alloying.