Sustainable Formation and Application of Thin Copper Alloy Layers by Reduction-Diffusion at Medium-Low Temperatures Using Ionic Liquid Baths

离子液体浴中低温还原扩散铜合金薄层的可持续形成及应用

• 批准号: 21360369
• 负责人: MURASE Kuniaki
• 金额: $ 11.65万
• 依托单位: Kyoto University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B)
• 财政年份: 2009
• 资助国家: 日本
• 起止时间: 2009 至 2011
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-21360369/
• 关键词: イオン液体; 還元拡散; 合金形成; リチウムイオン電池; 負極材料; 薄膜; 黄銅; めっき; サイクル特性; 室温溶融塩; 常温溶融塩; 電析

Layers of Cu-Sn intermetallic compounds were formed by cathodic elec-trochemical alloying of electroless Cu layers with Sn using an ionic liqui bath containing Sn2+ ions at 150°C. The technique is called "reduction-diffusion(RD)" and the intermetallics formed(i. e. Cu6Sn5 and Cu3Sn) were dependent on the alloying potential. In the present work, we investigated the perfor-mance of the Cu6Sn5 layer as an anode of Li-ion battery. The formation of brass(Cu-Zn alloy) layers was also examined and it was found that Cu-Zn phases, i. e. y-Cu5Zn8, 13'-CuZn, and/or a-Cu(Zn), which define the color of the layers, were dependent on applied potential during the alloying.

在150°C下，用含Sn ~（2+）离子的离子液体电解液对化学镀铜层进行阴极电化学合金化，形成了Cu-Sn金属间化合物层。该技术被称为“还原扩散（RD）”和金属间化合物形成（即。e. Cu_6Sn_5和Cu_3Sn）的含量取决于合金化电位。本文研究了Cu_6Sn_5层作为锂离子电池负极的性能。研究了黄铜（铜锌合金）层的形成过程，发现铜锌合金层中存在铜锌相，即铜锌相。e.γ-Cu_5 Zn_8、13 ′-Cu_Zn和/或α-Cu（Zn）（它们限定了层的颜色）取决于合金化过程中施加的电位。

项目成果

中低温イオン液体浴を用いた還元拡散法によるCu-Sn合金皮膜形成

中低温离子液体浴还原扩散法形成Cu-Sn合金膜

• 发表时间: 2009
• 作者: 邑瀬邦明;伊藤輝;一井崇;杉村博之
• 通讯作者: 杉村博之

Cu-Zn Alloy Metallization of Polymer through Reduction-Diffusion Method Using Ionic Liquid Bath at Medium-Low Temperatures

中低温离子液浴还原扩散法聚合物铜锌合金金属化

• 发表时间: 2010
• 作者: S. Takizawa;Y. Okuda;A. Nakazawa;M. Inoue;M. Umeda;Kuniaki Murase
• 通讯作者: Kuniaki Murase

Cu-Sn Alloy Metallization of Polymer Substrate through Reduction-Diffusion Method Using Ionic Liquid Bath at Medium-Low Temperatures

中低温离子液浴还原扩散法聚合物基体铜锡合金金属化

• 发表时间: 2009
• 期刊: Electrochemistry 77
• 作者: S. Asai;T. Kimura;K. Miyoshi;K. Saito;S. Yamada;H. Hirota;中尾真一;中尾真一;戸賀瀬健介;Akira Ito
• 通讯作者: Akira Ito

Electrochemical Lithiation of Stoichiometric Cu_6iSn_5 and Cu_3Sn Layers Prepared by Potentiostatic Reduction-Diffusion Method

恒电位还原扩散法制备化学计量Cu_6iSn_5和Cu_3Sn层的电化学锂化

• 发表时间: 2011
• 作者: Malahalli S. Vijaya Kumar;栗林一彦;北薗幸一;依田眞一;Naoki Fukuda
• 通讯作者: Naoki Fukuda

Potentiostatic Cu-Zn Alloying for Polymer Metallization Using Medium-Low Temperature Ionic Liquid Baths

使用中低温离子液体浴进行聚合物金属化的恒电位铜锌合金化

• 发表时间: 2010
• 作者: K. Murase;K. Yanase;T. Ichii;and H. Sugi-mura
• 通讯作者: and H. Sugi-mura