Digital monitoring for prognostics to defects due to atomic migration

对原子迁移导致的缺陷进行数字监测

• 批准号: 21760068
• 负责人: SHIBUTANI Tadahiro
• 金额: $ 2.66万
• 依托单位: Yokohama National University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Young Scientists (B)
• 财政年份: 2009
• 资助国家: 日本
• 起止时间: 2009 至 2010
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-21760068/
• 关键词: 原子輸送; 微小欠陥; 応力; 破壊予知; モニタリング

The aim of this project is to establish a methodology of in-situ observation for phenomena of small defects due to atomic transportation. Key technology is to predict the site of defects under some environmental conditions. In this study, pressure-induced tin whisker test was conducted for silver doped tin surface finish. Since doped silver can mitigates tin whiskers, it is not suitable for monitoring of tin whisker. On the other hand, long whiskers were observed under corroded samples with electric currents. The driving force of tin whiskers, stress gradient in the surface finish, was generated by surface oxides and distorted electric currents. Based on the above mechanism of tin whiskers, In-situ observation system for tin whiskers were proposed by using micro-manipurator and atomic force microscopy.

本计画的目的是建立一种原位观察原子输运所造成的微小缺陷现象的方法。关键技术是在一定的环境条件下预测缺陷的位置。在本研究中，压力诱导锡晶须测试进行了银掺杂锡表面光洁度。由于掺杂银可以减轻锡须，因此不适合用于锡须的监测。另一方面，在电流腐蚀下观察到长的晶须。锡须的驱动力，表面光洁度的应力梯度，是由表面氧化物和扭曲电流产生的。基于上述锡晶须的形成机理，提出了一种基于微操作器和原子力显微镜的锡晶须原位观察系统。

项目成果

Tin Whisker Reliability in Microelectronics

微电子领域锡晶须的可靠性

• 发表时间: 2009
• 期刊: Micromaterials and Nanomaterials No.9
• 作者: T.Shibutani;et.al.
• 通讯作者: et.al.

Effect of Grain Size on Pressure Induced Tin Whisker Formation

晶粒尺寸对压力诱导锡晶须形成的影响

• 发表时间: 2010
• 期刊: IEEE Transactions on Electronics Packaging & Manufacturing Vol.33, Issue 3
• 作者: 平岡直樹;松崎亮介;轟章;水谷義弘;Tadahiro Shibutani
• 通讯作者: Tadahiro Shibutani

錫ウィスカ発生におけるAg添加の影響

Ag添加量对锡晶须产生的影响

• 发表时间: 2009
• 期刊: 日本機械学会2009年度次大会講演論文集 No.09-1
• 作者: 奈良崎史貴;礒島伸;薩摩順吉;澁谷忠弘
• 通讯作者: 澁谷忠弘

Effect of grain size on pressure induced tin whiskers

晶粒尺寸对压力诱导锡晶须的影响

• 发表时间: 2009
• 作者: Lei Du;Tomohiro Sogabe;Shao-Liang Zhang;澁谷忠弘
• 通讯作者: 澁谷忠弘