Development of laser-assisted three-dimensional-wiring technology inside insulated substrates by short pulse irradiation

为了验证激光辅助三维布线技术的可行性，采用近红外短脉冲辐照聚酰亚胺基片。结果表明，改性聚酰亚胺的宽度为20-30 μm，长度为250-270 μm。这些区域由许多尺寸小于或等于20 μm的微空洞组成。虽然无法在基底内部制造连续的微通道，但我们成功地在无氧条件下进行了银纳米颗粒的激光烧结。这表明微通道中的颗粒的激光烧结的可能性。

To confirm the feasibility of the laser-assisted three-dimensional-wiring technology, near-infrared short pulses were irradiated inside polyimide substrates. As a result, formation of modified polyimide with 20-30 μm in width and 250-270 μm in length was observed. The regions consist of a lot of micro voids with 20 μm or less in size. Although fabrication of continuous micro-channels inside the substrate could not be achieved, we succeeded in carrying out laser sintering of Ag nano-particles under oxygen-free condition. This indicates possibility of the laser sintering of the particles in micro-channels.