Development of laser-assisted three-dimensional-wiring technology inside insulated substrates by short pulse irradiation

短脉冲照射激光辅助绝缘基板内三维布线技术的发展

• 批准号: 21760095
• 负责人: YAMASAKI Kazuhiko
• 金额: $ 2.83万
• 依托单位: Ibaraki University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Young Scientists (B)
• 财政年份: 2009
• 资助国家: 日本
• 起止时间: 2009 至 2010
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-21760095/
• 关键词: ナノ・マイクロ加工; レーザ焼結

To confirm the feasibility of the laser-assisted three-dimensional-wiring technology, near-infrared short pulses were irradiated inside polyimide substrates. As a result, formation of modified polyimide with 20-30 μm in width and 250-270 μm in length was observed. The regions consist of a lot of micro voids with 20 μm or less in size. Although fabrication of continuous micro-channels inside the substrate could not be achieved, we succeeded in carrying out laser sintering of Ag nano-particles under oxygen-free condition. This indicates possibility of the laser sintering of the particles in micro-channels.

为了验证激光辅助三维布线技术的可行性，采用近红外短脉冲辐照聚酰亚胺基片。结果表明，改性聚酰亚胺的宽度为20-30 μm，长度为250-270 μm。这些区域由许多尺寸小于或等于20 μm的微空洞组成。虽然无法在基底内部制造连续的微通道，但我们成功地在无氧条件下进行了银纳米颗粒的激光烧结。这表明微通道中的颗粒的激光烧结的可能性。

项目成果

短パルスレーザによる絶縁基板内部の3次元微細加工

使用短脉冲激光在绝缘基板内进行 3D 微加工

• 发表时间: 2011
• 作者: T.Tsuru;Y.Aoyagi;Y.Kaji;山崎 和彦
• 通讯作者: 山崎 和彦