3D printer for Additively Manufactured Electronics

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Digitalization, Artificial Intelligence, and Industry 4.0 are key areas in which the manufacturing process "Additively Manufacturing Electronics" (AME) plays a significant role. The integration of electronics into components allows for the development of intelligent sensors and connected systems with increased efficiency and productivity. AME enables rapid prototyping and product development, allowing research institutions and companies to optimize their innovation processes. The tailored solutions and design freedom of AME support adaptation to the specific requirements of these forward-looking areas. By acquiring a 3D AME printer, the Laboratory for Microelectronics at the University of Freiburg is enabled to transform its self-developed and manufactured application-specific integrated circuits (ASICs) into complex systems using state-of-the-art manufacturing processes. The requested 3D AME printer will enable the co-integrated printing of dielectrics and metals, using inkjet technology to combine UV-cured dielectric materials with IR-sintered silver nanoparticles to create high-resolution electrical structures. Such co-integrated printing in arbitrary three-dimensional geometries allows for the electrical contacting of the manufactured ASICs in an innovative way while simultaneously protecting them from external influences. Instead of the typically planar combination of electrical components in common printed circuit board (PCB) assembly, stacked, orthogonal, or even spherical arrangements of individual components are possible, resulting in significantly smaller form factors. The printing process and low manufacturing temperature allow for pausing the printing and thus the package-free embedding of ASICs as so-called Bare Dies, minimizing the form factor and improving signal qualities due to the elimination of bond wires and shorter traces. Furthermore, the routing of conductors can be revolutionized by shielding them entirely within the 3D-printed enclosure, twisting them in larger groups, or finely tuning their impedances. The production of passive electrical components and 3D antennas is also possible, ultimately achieving a fusion of PCBs, passive components, and ASICs into a highly integrated microelectronic unit. In the end, a 3D AME printer reduces the need for external manufacturing and expands the capabilities of the Faculty of Engineering to manufacture multiphysical microsystems. Research on multiphysical sensing and highly integrated brain-machine interfaces is being promoted. In education, the printer enables practical experience with parasitic ASIC effects and their impact on sensitive circuits.