3D printer for Additively Manufactured Electronics

用于增材制造电子产品的 3D 打印机

• 批准号: 539303076
• 金额: --
• 依托单位: Albert-Ludwigs-Universität Freiburg
• 依托单位国家: 德国
• 项目类别: Major Research Instrumentation
• 财政年份: 2024
• 资助国家: 德国
• 起止时间: 2023-12-31 至 无数据
• 项目状态: 未结题
• 来源: https://gepris.dfg.de/gepris/projekt/539303076?language=en
• 关键词: 3D; printer; Additively; Manufactured; Electronics

Digitalization, Artificial Intelligence, and Industry 4.0 are key areas in which the manufacturing process "Additively Manufacturing Electronics" (AME) plays a significant role. The integration of electronics into components allows for the development of intelligent sensors and connected systems with increased efficiency and productivity. AME enables rapid prototyping and product development, allowing research institutions and companies to optimize their innovation processes. The tailored solutions and design freedom of AME support adaptation to the specific requirements of these forward-looking areas. By acquiring a 3D AME printer, the Laboratory for Microelectronics at the University of Freiburg is enabled to transform its self-developed and manufactured application-specific integrated circuits (ASICs) into complex systems using state-of-the-art manufacturing processes. The requested 3D AME printer will enable the co-integrated printing of dielectrics and metals, using inkjet technology to combine UV-cured dielectric materials with IR-sintered silver nanoparticles to create high-resolution electrical structures. Such co-integrated printing in arbitrary three-dimensional geometries allows for the electrical contacting of the manufactured ASICs in an innovative way while simultaneously protecting them from external influences. Instead of the typically planar combination of electrical components in common printed circuit board (PCB) assembly, stacked, orthogonal, or even spherical arrangements of individual components are possible, resulting in significantly smaller form factors. The printing process and low manufacturing temperature allow for pausing the printing and thus the package-free embedding of ASICs as so-called Bare Dies, minimizing the form factor and improving signal qualities due to the elimination of bond wires and shorter traces. Furthermore, the routing of conductors can be revolutionized by shielding them entirely within the 3D-printed enclosure, twisting them in larger groups, or finely tuning their impedances. The production of passive electrical components and 3D antennas is also possible, ultimately achieving a fusion of PCBs, passive components, and ASICs into a highly integrated microelectronic unit. In the end, a 3D AME printer reduces the need for external manufacturing and expands the capabilities of the Faculty of Engineering to manufacture multiphysical microsystems. Research on multiphysical sensing and highly integrated brain-machine interfaces is being promoted. In education, the printer enables practical experience with parasitic ASIC effects and their impact on sensitive circuits.

数字化，人工智能和行业4.0是制造过程“加上制造电子产品”（AME）发挥重要作用的关键领域。将电子设备集成到组件中，可以开发智能传感器和连接的系统，并提高效率和生产力。 AME实现了快速的原型制作和产品开发，使研究机构和公司能够优化其创新流程。量身定制的解决方案和设计自由度支持适应这些前瞻性领域的特定要求。通过收购3D AME打印机，弗莱堡大学的微电子实验室可以使用最先进的制造过程将其自我开发和制造的特定应用集成电路（ASIC）转换为复杂的系统。请求的3D AME打印机将使用喷墨技术将介电和金属的协同印刷结合起来，将UV固定电介质材料与IR插入的银色纳米颗粒相结合，以创建高分辨率的电气结构。这种以任意三维几何形状的协调印刷可以以创新的方式与制造的ASIC进行电气接触，同时保护它们免受外部影响。可以使用普通印刷电路板（PCB）组件中的电气组件的典型平面组合，而是单个组件的堆叠，正交或什至球形排列，从而导致形式较小。印刷过程和低制造温度可以暂停打印，从而将ASIC的无包装嵌入为所谓的裸露死亡，从而最大程度地减少外形和提高信号质量，从而提高了信号质量。此外，可以通过将它们完全屏蔽在3D打印的外壳中，将其扭曲成较大的群体或细微调整其阻抗来彻底改变导体的路由。被动电气组件和3D天线的生产也是可能的，最终将PCB，被动组件和ASIC融合到高度集成的微电源单元中。最后，3D AME打印机减少了对外部制造的需求，并扩展了工程学院制造多物理微系统的能力。正在促进有关多物理传感和高度集成的脑机界面的研究。在教育方面，打印机可以具有寄生效果及其对敏感电路的影响的实践经验。