3D printer for Additively Manufactured Electronics

数字化、人工智能和工业4.0是制造过程“增材制造电子”（AME）发挥重要作用的关键领域。将电子元件集成到组件中可以开发智能传感器和连接系统，提高效率和生产力。AME使快速原型和产品开发，允许研究机构和公司优化他们的创新过程。AME的定制解决方案和设计自由度支持适应这些前瞻性领域的特定要求。通过获得3D AME打印机，弗莱堡大学微电子实验室能够将其自主开发和制造的专用集成电路（asic）转化为使用最先进制造工艺的复杂系统。要求的3D AME打印机将实现电介质和金属的集成打印，使用喷墨技术将uv固化电介质材料与ir烧结银纳米颗粒相结合，以创建高分辨率的电气结构。这种任意三维几何形状的协整印刷允许制造的asic以创新的方式进行电接触，同时保护它们免受外部影响。在普通印刷电路板（PCB）组装中，不同于电子元件的典型平面组合，单个元件的堆叠、正交或甚至球形排列是可能的，从而大大减小了外形因素。印刷工艺和较低的制造温度允许暂停印刷，因此asic的无封装嵌入称为裸模，由于消除了键合线和较短的走线，最大限度地减少了形状因素并改善了信号质量。此外，通过将导体完全屏蔽在3d打印外壳内，将它们扭曲成更大的组，或微调它们的阻抗，可以彻底改变导体的布线。无源电子元件和3D天线的生产也是可能的，最终实现pcb，无源元件和asic融合成一个高度集成的微电子单元。最后，3D AME打印机减少了外部制造的需要，并扩展了工程学院制造多物理微系统的能力。多物理体传感和高集成脑机接口的研究正在推进。在教育中，打印机使寄生ASIC效应及其对敏感电路的影响的实践经验。

Digitalization, Artificial Intelligence, and Industry 4.0 are key areas in which the manufacturing process "Additively Manufacturing Electronics" (AME) plays a significant role. The integration of electronics into components allows for the development of intelligent sensors and connected systems with increased efficiency and productivity. AME enables rapid prototyping and product development, allowing research institutions and companies to optimize their innovation processes. The tailored solutions and design freedom of AME support adaptation to the specific requirements of these forward-looking areas. By acquiring a 3D AME printer, the Laboratory for Microelectronics at the University of Freiburg is enabled to transform its self-developed and manufactured application-specific integrated circuits (ASICs) into complex systems using state-of-the-art manufacturing processes. The requested 3D AME printer will enable the co-integrated printing of dielectrics and metals, using inkjet technology to combine UV-cured dielectric materials with IR-sintered silver nanoparticles to create high-resolution electrical structures. Such co-integrated printing in arbitrary three-dimensional geometries allows for the electrical contacting of the manufactured ASICs in an innovative way while simultaneously protecting them from external influences. Instead of the typically planar combination of electrical components in common printed circuit board (PCB) assembly, stacked, orthogonal, or even spherical arrangements of individual components are possible, resulting in significantly smaller form factors. The printing process and low manufacturing temperature allow for pausing the printing and thus the package-free embedding of ASICs as so-called Bare Dies, minimizing the form factor and improving signal qualities due to the elimination of bond wires and shorter traces. Furthermore, the routing of conductors can be revolutionized by shielding them entirely within the 3D-printed enclosure, twisting them in larger groups, or finely tuning their impedances. The production of passive electrical components and 3D antennas is also possible, ultimately achieving a fusion of PCBs, passive components, and ASICs into a highly integrated microelectronic unit. In the end, a 3D AME printer reduces the need for external manufacturing and expands the capabilities of the Faculty of Engineering to manufacture multiphysical microsystems. Research on multiphysical sensing and highly integrated brain-machine interfaces is being promoted. In education, the printer enables practical experience with parasitic ASIC effects and their impact on sensitive circuits.