Study of elementary process of novel cleaning method by investigation of surrounding condensable vapor effect on single droplet drag reduction

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In the cleaning processes of manufacturing semiconductor deVices, two-fluidspray cleaning technique is widely used. In this study, we fbcus our attention to the elementary process ofthis cleaning technique, i.e. a single droplet impact on a solid surface. We experimentally observe impact ofsingle droplet on a rigid solid surface. Especially we focus on the effects of surfaces tension, surfaceroughness and surrounding pressure. Decrease of the surrounding gas pressure makes droplets alwayscreate lamella even in the cases with low surface tension and rough surfaces