A study on the formation mechanism of internal stress in electrodeposition within the framework of dynamic scaling theory

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In the framework of dynamic scaling theory, the internal stress deposited by a pulse current technique is found to be described by the relaxation in which process adatoms on the film surface move to reduce the grain boundary energy. In addition, using a concept of the quenched noise that acts as obstacles that impede the movement of the adatom, the order parameter becomes dependent on the content of additives and the internal stress is found to comprise two terms, one dependent on the additive content and the other independent of the additive content. In-situ observation of the time-dependent internal stress reveals the presence of incubation time in which no internal stress occurs and the oscillatory behavior of the internal stress that approaches a fixed value.