Improvement of Indentation Creep Method for Electronic Packages by Monitoring Stress Relaxation Behavior

压痕蠕变试验有望在电子封装强度可靠性评估中得到实际应用。但存在的问题是，由试验得出的蠕变规律与由拉伸蠕变试验得出的蠕变规律不一致。研究表明，这个问题是由压痕试验中计算应力的参考区域的定义引起的。基于这一事实，提出了一种新的压痕试验参考面积和一种通过监测应力松弛行为来评价蠕变特性的压痕试验方法。

The indentation creep test is expected to be put into practical use for evaluating the strength reliability of electronic packages. However, there is a problem that the creep law derived by the test does not correspond to that derived by tensile creep tests. This study showed that this problem was caused by the definition of the reference area for calculating the stress in the indentation test. Based on this fact, a new reference area for indentation tests and a new indentation test method which evaluates creep characteristics by monitoring stress relaxation behavior were proposed.