Improvement of Indentation Creep Method for Electronic Packages by Monitoring Stress Relaxation Behavior
通过监测应力松弛行为改进电子封装压痕蠕变方法
基本信息
- 批准号:22560070
- 负责人:
- 金额:$ 2.83万
- 依托单位:
- 依托单位国家:日本
- 项目类别:Grant-in-Aid for Scientific Research (C)
- 财政年份:2010
- 资助国家:日本
- 起止时间:2010 至 2012
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
The indentation creep test is expected to be put into practical use for evaluating the strength reliability of electronic packages. However, there is a problem that the creep law derived by the test does not correspond to that derived by tensile creep tests. This study showed that this problem was caused by the definition of the reference area for calculating the stress in the indentation test. Based on this fact, a new reference area for indentation tests and a new indentation test method which evaluates creep characteristics by monitoring stress relaxation behavior were proposed.
压痕蠕变试验有望用于评估电子封装的强度可靠性。但存在一个问题,即试验得到的蠕变规律与拉伸蠕变试验得到的蠕变规律不一致。这项研究表明,这一问题是由于压痕试验中计算应力的参考区的定义造成的。基于这一事实,提出了一种新的压痕试验参照区和一种通过监测应力松弛行为来评价蠕变特性的压痕试验方法。
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
圧子押込み・深さ保持によるはんだのクリープ特性評価法の提案
使用压头压痕和深度保持的焊料蠕变特性评价方法的提案
- DOI:
- 发表时间:2012
- 期刊:
- 影响因子:0
- 作者:瀧田敦子;大口健一;佐々木克彦
- 通讯作者:佐々木克彦
A New Reference Area for Indentation Creep Tests to Obtain Real Steady Creep Strain of Solder Alloy
压痕蠕变试验的新参考区域以获得焊料合金的真实稳态蠕变应变
- DOI:
- 发表时间:2013
- 期刊:
- 影响因子:0
- 作者:Atsuko Takita;Katsuhiko Sasaki;and Ken-ichi Ohguchi
- 通讯作者:and Ken-ichi Ohguchi
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OHGUCHI Ken-ichi其他文献
OHGUCHI Ken-ichi的其他文献
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{{ truncateString('OHGUCHI Ken-ichi', 18)}}的其他基金
ELASTO-PLASTIC-CREEP CHARACTERISTICS OF ELECTROPLATED COPPER FOIL AND ITS ESTIMATION BY STEPPED MICRO INDENTATION
电镀铜箔的弹塑性蠕变特性及其阶梯式微压痕估算
- 批准号:
19560071 - 财政年份:2007
- 资助金额:
$ 2.83万 - 项目类别:
Grant-in-Aid for Scientific Research (C)
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