Improvement of Indentation Creep Method for Electronic Packages by Monitoring Stress Relaxation Behavior

压痕蠕变试验有望在评价电子封装材料的强度可靠性方面投入实际应用。然而，存在一个问题，即试验得出的蠕变规律与拉伸蠕变试验得出的规律不一致。研究表明，这一问题是由压痕试验中计算应力参考区域的定义引起的。在此基础上，提出了一种新的压痕试验参考区域和一种通过监测应力松弛行为来评价蠕变特性的压痕试验新方法。

The indentation creep test is expected to be put into practical use for evaluating the strength reliability of electronic packages. However, there is a problem that the creep law derived by the test does not correspond to that derived by tensile creep tests. This study showed that this problem was caused by the definition of the reference area for calculating the stress in the indentation test. Based on this fact, a new reference area for indentation tests and a new indentation test method which evaluates creep characteristics by monitoring stress relaxation behavior were proposed.