Development of Virtual Reliability Design Methodology for Interconnections Involved in Microelectronics and Optoelectronics

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The objektive of this project is to establish a virtual reliability design methodology, including new measurement methods, based on scanning electron microscope (SEM) and scanning probe microscope (SPM), for validation of core material models to be developed for advanced microelectronics and optoelectronics. lt is proposed that a unified visco-elasto-plasticity relationship, a fracture criterion, and a fatigue life prediction model will be established, based on fully understanding of mechanical, physical, creep, fatigue and fracture properties of small AuSn eutectic solder joints. The data-base will provide a solid basis for the establishment of numerical approaches. Moreover, high temperature creep and low temperature fracture will be taken into consideration in the material models. lt is also proposed that SEM- and/or SPM-based experimental measurement techniques, so-called SEM-moire and microDAC and/or nanoDAC, will be developed for the determination of micro-/nano-deformation. The former is based on the combination of the SEM grating Generation and optical multiplication technique and the later is based on the combination of SEM and/or SPM imaging and digital correlation technique. With these techniques, much higher measurement sensitivity (in nanometer) and spatial resolution (in micrometer) will be achieved than that with current measurement techniques. lt is also proposed that finite element models will be established, based on the proposed material models, and verified by the proposed measurement techniques. As a result, a virtual reliability design methodology will be implemented for both microelectronics and optoelectronics interconnection applications.