Development of Virtual Reliability Design Methodology for Interconnections Involved in Microelectronics and Optoelectronics

微电子和光电子领域互连虚拟可靠性设计方法的发展

• 批准号: 5397489
• 负责人: Professor Dr.-Ing. Herbert Reichl
• 金额: --
• 依托单位: Fachgebiet Mikroelektronik - Aufbau- und Verbindungstechniken
• 依托单位国家: 德国
• 项目类别: Research Grants
• 财政年份: 2003
• 资助国家: 德国
• 起止时间: 2002-12-31 至 2006-12-31
• 项目状态: 已结题
• 来源: https://gepris.dfg.de/gepris/projekt/5397489?language=en
• 关键词: Development; Virtual; Reliability; Design; Methodology

The objektive of this project is to establish a virtual reliability design methodology, including new measurement methods, based on scanning electron microscope (SEM) and scanning probe microscope (SPM), for validation of core material models to be developed for advanced microelectronics and optoelectronics. lt is proposed that a unified visco-elasto-plasticity relationship, a fracture criterion, and a fatigue life prediction model will be established, based on fully understanding of mechanical, physical, creep, fatigue and fracture properties of small AuSn eutectic solder joints. The data-base will provide a solid basis for the establishment of numerical approaches. Moreover, high temperature creep and low temperature fracture will be taken into consideration in the material models. lt is also proposed that SEM- and/or SPM-based experimental measurement techniques, so-called SEM-moire and microDAC and/or nanoDAC, will be developed for the determination of micro-/nano-deformation. The former is based on the combination of the SEM grating Generation and optical multiplication technique and the later is based on the combination of SEM and/or SPM imaging and digital correlation technique. With these techniques, much higher measurement sensitivity (in nanometer) and spatial resolution (in micrometer) will be achieved than that with current measurement techniques. lt is also proposed that finite element models will be established, based on the proposed material models, and verified by the proposed measurement techniques. As a result, a virtual reliability design methodology will be implemented for both microelectronics and optoelectronics interconnection applications.

本项目的目的是建立一种虚拟可靠性设计方法，包括基于扫描电子显微镜(SEM)和扫描探针显微镜(SPM)的新测量方法，用于验证将为先进微电子学和光电子学开发的核心材料模型。在充分了解小尺寸奥锡共晶焊点的力学、物理、蠕变、疲劳和断裂特性的基础上，提出建立统一的粘弹塑性关系、断裂判据和疲劳寿命预测模型。该数据库将为建立数值方法提供坚实的基础。此外，材料模型还将考虑高温蠕变和低温断裂。还建议发展基于扫描电子显微镜和/或扫描电子显微镜的实验测量技术，即所谓的扫描电子显微镜云纹和微DAC和/或纳米DAC，以确定微/纳米变形。前者是基于扫描电子显微镜产生光栅和光学倍增技术的结合，后者是基于扫描电子显微镜和/或扫描电子显微镜成像和数字相关技术的结合。有了这些技术，测量灵敏度(以纳米为单位)和空间分辨率(以微米为单位)将比目前的测量技术高得多。还建议在所提出的材料模型的基础上建立有限元模型，并用所提出的测量技术进行验证。因此，将对微电子和光电子互连应用实施虚拟可靠性设计方法。