Damage-free etching of organic materials with mesoscopic cluster beams

利用吸附电池，通过控制辐照过程中的电荷状态、簇大小和环境气体，研究了介观簇离子束对有机材料的无损伤加工。将原位XPS系统与簇束离子束系统相连接，用于有机材料的损伤评价。研究表明，低电离电压是抑制多电荷簇离子形成的必要条件。此外，大簇离子和辐照过程中环境气体的控制对有机材料的低损伤处理是有效的。

Damage-free processing of organic materials with mesoscopic cluster ion beam was developed using pickup cell and by controlling charge state, cluster-size, and environment gas during irradiations. An in-situ XPS system connected to cluster ion beam system was used for damage evaluation of organic materials. It has been clarified that low-ionization voltage is required to suppress formation of multiply charged cluster ions. Besides, large cluster ions, and control of environment gas during irradiation is effective for low-damage processing of organic materials.